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參數(shù)資料
| 型號： | MPE603ERX100LX |
| 廠商： | MOTOROLA INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 100 MHz, RISC PROCESSOR, CBGA255 |
| 封裝： | CERAMIC, BGA-255 |
| 文件頁數(shù)： | 24/32頁 |
| 文件大小： | 135K |
| 代理商： | MPE603ERX100LX |
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30
EC603e Microprocessor Hardware Specifications (PID6)
Assuming an air velocity of 0.5 m/s, we have an effective Rsa of 7 °C/W, thus
Tj = 30°C + 5°C + (2.2 °C/W +1.0 °C/W + 7 °C/W) * 4.5 W,
resulting in a die-junction temperature of approximately 81 °C which is well within the maximum operating
temperature of the component.
Other heat sinks offered by Chip Coolers, IERC, Thermalloy, Wakeeld Engineering, and Aavid
Engineering offer different heat sink-to-ambient thermal resistances, and may or may not need air ow.
Though the die junction-to-ambient and the heat sink-to-ambient thermal resistances are a common gure-
of-merit used for comparing the thermal performance of various microelectronic packaging technologies,
one should exercise caution when only using this metric in determining thermal management because no
single parameter can adequately describe three-dimensional heat ow. The nal die-junction operating
temperature, is not only a function of the component-level thermal resistance, but the system-level design
and its operating conditions. In addition to the component's power consumption, a number of factors affect
the nal operating die-junction temperature—airow, board population (local heat ux of adjacent
components), heat sink efciency, heat sink attach, heat sink placement, next-level interconnect technology,
system air temperature rise, altitude, etc.
Due to the complexity and the many variations of system-level boundary conditions for today's
microelectronic equipment, the combined effects of the heat transfer mechanisms (radiation, convection and
conduction) may vary widely. For these reasons, we recommend using conjugate heat transfer models for
the board, as well as, system-level designs. To expedite system-level thermal analysis, several “compact”
thermal-package models are available within FLOTHERM. These are available upon request.
1.9 Document Revision History
1.10 Ordering Information
This section provides the part numbering nomenclature for the PID6. Note that the individual part numbers
correspond to a maximum processor core frequency. For available frequencies, contact your local Motorola
sales ofce.
Figure 18 provides the Motorola part numbering nomenclature for the PID6. In addition to the processor
frequency, the part numbering scheme also consists of a part modier and application modier. The part
modier indicates any enhancement(s) in the part from the original production design. The bus divider may
specify special bus frequencies or application conditions. Each part number also contains a revision code.
This refers to the die mask revision number and is specied in the part numbering scheme for identication
purposes only.
Table 13. Document Revision History
Document Revision
Substantive Change(s)
Rev 1
In Table 6, the minimun processor frequency for the 100 mhz and the 133 mhz parts was
changed to 50 mhz. The maximum VCO frequency was changed to 266.66 mhz on and
the minimum VCO frequency on the 133 mhz part was changed to 100 mhz.
In Table 12 the CPU and VCO frequencies were changed to correspond to the the valid
clock specications as shown in Table 6.
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| MPE603ERX133LN | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:PowerPC 603e RISC Microprocessor Family: PID6-603e (Stretch) Part Number Specifications |
| MPE603RRX200LC | 制造商:Freescale Semiconductor 功能描述: |
| MPE603RRX266LC | 制造商:Motorola Inc 功能描述: |
| MPE-60S | 制造商:MPD 制造商全稱:MicroPower Direct, LLC 功能描述:Single Output, 60W Compact, Enclosed AC/DC Power Supplies |
| MPE-60S-05 | 制造商:MPD 制造商全稱:MicroPower Direct, LLC 功能描述:Single Output, 60W Compact, Enclosed AC/DC Power Supplies |
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