參數(shù)資料
型號(hào): MPE603ERX100LX
廠商: MOTOROLA INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 100 MHz, RISC PROCESSOR, CBGA255
封裝: CERAMIC, BGA-255
文件頁數(shù): 13/32頁
文件大?。?/td> 135K
代理商: MPE603ERX100LX
20
EC603e Microprocessor Hardware Specifications (PID6)
1.7 Package Description
The following sections provide the package parameters and the mechanical dimensions for the PID6.
1.7.1 CQFP Package Description
The following sections provide the package parameters and mechanical dimensions for the Motorola CQFP
package.
1.7.1.1 Package Parameters
The package parameters are as provided in the following list. The package type is 32 mm x 32 mm, 240-pin
ceramic quad at pack.
Package outline
32 mm x 32 mm
Interconnects
240
Pitch
0.5 mm
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