參數(shù)資料
型號(hào)： MPE603ERX100LX
廠商： MOTOROLA INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 100 MHz, RISC PROCESSOR, CBGA255
封裝： CERAMIC, BGA-255
文件頁數(shù)： 22/32頁
文件大?。?/td> 135K
代理商： MPE603ERX100LX
EC603e Microprocessor Hardware Specifications (PID6)
29
1.8.6.3 Heat Sink Selection Example
For preliminary heat sink sizing, the die-junction temperature can be expressed as follows:
Tj = Ta + Tr + (θjc + θint + θsa) * Pd
Where:
Tj is the die-junction temperature
Ta is the inlet cabinet ambient temperature
Tr is the air temperature rise within the computer cabinet
θ
jc is the junction-to-case thermal resistance
θ
int is the adhesive or interface material thermal resistance
θ
sa is the heat sink base-to-ambient thermal resistance
Pd is the power consumed by the device
During operation the die-junction temperatures (Tj) should be maintained less than the value specied in
Table 2. The temperature of the air cooling the component greatly depends upon the ambient inlet air
temperature and the air temperature rise within the electronic cabinet. An electronic cabinet inlet-air
temperature (Ta) may range from 30 to 40 °C. The air temperature rise within a cabinet (Tr) may be in the
range of 5 to 10 °C. The thermal resistance of the thermal interface material (
θ
int) is typically about 1 °C/
W. Assuming a Ta of 30 °C, a Tr of 5 °C, a CQFP package θjc = 2.2, and a power consumption (Pd) of 4.5
watts, the following expression for Tj is obtained:
Die-junction temperature: Tj = 30 °C + 5 °C + (2.2 °C/W + 1.0 °C/W + Rsa) * 4.5 W
For a Thermalloy heat sink #2328B, the heat sink-to-ambient thermal resistance (Rsa) versus airow
velocity is shown in Figure 17.
Figure 17. Thermalloy #2328B Heat Sink-to-Ambient Thermal Resistance Versus Airflow Velocity
1
3
5
7
8
0
0.5
1
1.5
2
2.5
3
3.5
Thermalloy #2328B Pin-fin Heat Sink
Approach Air Velocity (m/s)
Heat
Sink
Thermal
Resistance
(C/W)
(25 x28 x 15 mm)
2
4
6
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