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參數(shù)資料
| 型號(hào)： | MPE603ERX100LX |
| 廠商： | MOTOROLA INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 100 MHz, RISC PROCESSOR, CBGA255 |
| 封裝： | CERAMIC, BGA-255 |
| 文件頁數(shù)： | 21/32頁 |
| 文件大?。?/td> | 135K |
| 代理商： | MPE603ERX100LX |
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EC603e Microprocessor Hardware Specifications (PID6)
Figure 16. Thermal Performance of Select Thermal Interface Material
The board designer can choose between several types of thermal interface. Heat sink adhesive materials
should be selected based upon high conductivity, yet adequate mechanical strength to meet equipment
shock/vibration requirements. There are several commercially-available thermal interfaces and adhesive
materials provided by the following vendors:
Dow-Corning Corporation
517-496-4000
Dow-Corning Electronic Materials
PO Box 0997
Midland, MI 48686-0997
Chomerics, Inc.
617-935-4850
77 Dragon Court
Woburn, MA 01888-4850
Thermagon Inc.
216-741-7659
3256 West 25th Street
Cleveland, OH 44109-1668
Loctite Corporation
860-571-5100
1001 Trout Brook Crossing
Rocky Hill, CT 06067
AI Technology (e.g. EG7655)
609-882-2332
1425 Lower Ferry Rd
Trent, NJ 08618
0
0.5
1
1.5
2
0
1020304050607080
Silicone Sheet (0.006 inch)
Bare Joint
Floroether Oil Sheet (0.007 inch)
Graphite/Oil Sheet (0.005 inch)
Synthetic Grease
Contact Pressure (psi)
Specific
Thermal
Resistance
(Kin
2
/W)
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