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參數(shù)資料
| 型號： | MPC8240EC |
| 廠商： | Motorola, Inc. |
| 英文描述： | Integrated Processor Hardware Specifications |
| 中文描述： | 綜合處理器硬件規(guī)格 |
| 文件頁數(shù)： | 44/52頁 |
| 文件大小： | 1027K |
| 代理商： | MPC8240EC |
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44
MPC8240 Integrated Processor Hardware Specifications
For More Information On This Product,
Go to: www.freescale.com
MOTOROLA
System Design Information
Shin-Etsu MicroSi, Inc.
10028 S. 51st St.
Phoenix, AZ 85044
Internet: www.microsi.com
Thermagon Inc.
4707 Detroit Ave.
Cleveland, OH 44102
Internet: www.thermagon.com
888-642-7674
888-246-9050
The following section provides a heat sink selection example using one of the commercially-available heat
sinks.
1.7.8.3
Heat Sink Selection Example
For preliminary heat sink sizing, the die-junction temperature, T
J,
can be expressed as follows:
T
J
= T
A
+ T
R
+ (R
θ
JC
+ R
θ
INT
+ R
θ
SA
)
×
P
D
where
T
J
is the die-junction temperature
T
A
is the inlet cabinet ambient temperature
T
R
is the air temperature rise within the computer cabinet
R
θ
JC
is the junction-to-case thermal resistance
R
θ
INT
is the adhesive or interface material thermal resistance
R
θ
SA
is the heat sink base-to-ambient thermal resistance
P
D
is the power dissipated by the device
During operation, the die-junction temperatures (T
J
) should be maintained at less than the value specified
in Table 2. The temperature of the air cooling the component greatly depends on the ambient inlet air
temperature and the air temperature rise within the electronic cabinet. An electronic cabinet inlet-air
temperature (T
A
) may range from 30° to 40°C. The air temperature rise within a cabinet (T
R
) may be in the
range of 5° to 10°C. The thermal resistance of the thermal interface material (R
θ
INT
) is typically about
1°C/W. Assuming a T
A
of 30°C, a T
R
of 5°C, a TBGA package R
θ
JC
= 1.8, and a power consumption (P
D
)
of 5.0 watts, the following expression for T
J
is obtained for die-junction temperature:
T
J
= 30°C + 5°C + (1.8°C/W + 1.0°C/W + R
θ
SA
)
×
5.0 W
For preliminary heat sink sizing, the heat sink base-to-ambient thermal resistance is needed from the heat
sink manufacturer.
Though the die junction-to-ambient and the heat sink-to-ambient thermal resistances are a common figure
of merit used for comparing the thermal performance of various microelectronic packaging technologies,
one should exercise caution when using only this metric in determining thermal management because no
single parameter can adequately describe three-dimensional heat flow. The final die-junction operating
temperature is not only a function of the component-level thermal resistance, but the system-level design
and its operating conditions. In addition to the component's power consumption, a number of factors affect
the final operating die-junction temperature: airflow, board population (local heat flux of adjacent
components), heat sink efficiency, heat sink attach, heat sink placement, next-level interconnect technology,
system air temperature rise, altitude, and so on.
Due to the complexity and the many variations of system-level boundary conditions for today’s
microelectronic equipment, the combined effects of the heat transfer mechanisms (radiation, convection,
F
Freescale Semiconductor, Inc.
n
.
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