參數(shù)資料
型號： MPC8240EC
廠商： Motorola, Inc.
英文描述： Integrated Processor Hardware Specifications
中文描述： 綜合處理器硬件規(guī)格
文件頁數(shù)： 42/52頁
文件大?。?/td> 1027K
代理商： MPC8240EC
42
MPC8240 Integrated Processor Hardware Specifications
For More Information On This Product,
Go to: www.freescale.com
MOTOROLA
System Design Information
Tyco Electronics
Chip Coolers
P.O. Box 3668
Harrisburg, PA 17105-3668
Internet: www.chipcoolers.com
Wakefield Engineering
33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com
800-522-6752
603-635-5102
Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal
performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost.
1.7.8.1
Internal Package Conduction Resistance
The intrinsic conduction thermal resistance paths for the TBGA, cavity-down, packaging technology shown
in Figure 26 are as follows:
The die junction-to-case thermal resistance
The die junction-to-ball thermal resistance
Figure 28 depicts the primary heat transfer path for a package with an attached heat sink mounted to a
printed-circuit board.
Figure 28. TBGA Package with Heat Sink Mounted to a Printed-Circuit Board
For this cavity-down, wire-bond TBGA package, heat generated on the active side of the chip is conducted
through the silicon, die attach, and package spreader, through the heat sink attach material (or thermal
interface material), and finally to the heat sink, where it is removed by forced-air convection.
1.7.8.2
Adhesives and Thermal Interface Materials
A thermal interface material is recommended at the package lid-to-heat sink interface to minimize thermal
contact resistance. For those applications where the heat sink is attached by a spring clip mechanism,
Figure 29 shows the thermal performance of three thin-sheet thermal-interface materials (silicone,
External Resistance
External Resistance
Internal Resistance
Radiation
Convection
Radiation
Convection
Heat Sink
Printed-Circuit Board
Thermal Interface Material
Package/Leads
Die Junction
Die/Package
(Note the internal versus external package resistance.)
F
Freescale Semiconductor, Inc.
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