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參數(shù)資料
| 型號(hào)： | LPC2368FBD100 |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類： | 數(shù)學(xué)處理器 |
| 英文描述： | ARM7 with 512 kB flash, 58 kB SRAM, Ethernet, USB 2.0 Device, CAN, SD-MMC, and 10-bit ADC |
| 封裝： | LPC2368FBD100<SOT407-1 (LQFP100)|<<http://www.nxp.com/packages/SOT407-1.html<1<Always Pb-free,; |
| 文件頁(yè)數(shù)： | 13/18頁(yè) |
| 文件大?。?/td> | 220K |
| 代理商： | LPC2368FBD100 |
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ES_LPC2368
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Errata sheet
Rev. 9 — 20 April 2011
13 of 18
NXP Semiconductors
ES_LPC2368
Errata sheet LPC2368
3.17 Deep power-down.1: Deep power-down mode is not functional
Introduction:
Deep power-down mode is like Power-down mode, but the on-chip regulator that supplies
power to internal logic is also shut off. This produces the lowest possible power
consumption without actually removing power from the entire chip.
Problem:
The power consumption in Deep power-down mode does not meet the specifications.
Work-around:
None.
3.18 VBAT.1: Increased power consumption on VBAT when VBAT is
powered before the 3.3 V supply used by rest of the device
Introduction:
The device has a VBAT pin which provides power only to the RTC and Battery RAM.
VBAT can be connected to a battery or the same 3.3 V supply used by rest of the device
(V
DD(3V3)
pin, V
DD(DCDC)(3V3)
pin).
Problem:
If VBAT is powered before the 3.3 V supply, VBAT is unable to source the start-up current
required for the Battery RAM. Therefore, power consumption on the VBAT pin will be high
and will remain high until 3.3 V supply is powered up. Once 3.3 V supply is powered up,
power consumption on the VBAT pin will reduce to normal and subsequent power cycle
on the 3.3 V supply will not cause an increased power consumption on the VBAT pin.
Work-around:
Provide 3.3 V supply used by rest of the device first and then provide VBAT voltage.
3.19 VBAT.2: The VBAT pin cannot be left floating
Introduction:
The device has a VBAT pin which provides power only to the Real Time Clock (RTC) and
Battery RAM. VBAT can be connected to a battery or the same supply used by rest of the
device (V
DD(3V3)
pin, V
DD(DCDC)(3V3)
pin). The input voltage range on the VBAT pin is 2.0 V
minimum to 3.6 V maximum for temperature
40
C to +85
C. Normally, if the RTC and
the Battery RAM are not used, the VBAT pin can be left floating.
Problem:
If the VBAT pin is left floating, the internal reset signal within the RTC domain may get
corrupted and as a result, prevents the device from starting-up.
Work-around:
The VBAT should be connected to a battery or the same supply used by rest of the device
(V
DD(3V3)
pin, V
DD(DCDC)(3V3)
pin).
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| LPC2368FBD100,551 | 功能描述:ARM微控制器 - MCU ARM7 512KF/USB/ENET RoHS:否 制造商:STMicroelectronics 核心:ARM Cortex M4F 處理器系列:STM32F373xx 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:72 MHz 程序存儲(chǔ)器大小:256 KB 數(shù)據(jù) RAM 大小:32 KB 片上 ADC:Yes 工作電源電壓:1.65 V to 3.6 V, 2 V to 3.6 V, 2.2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:LQFP-48 安裝風(fēng)格:SMD/SMT |
| LPC2368FBD100/CP32 | 制造商:NXP Semiconductors 功能描述:- Tape and Reel |
| LPC2368FBD100551 | 制造商:NXP Semiconductors 功能描述:IC 32BIT MCU 72MHZ LQFP-100 |
| LPC2368FET100 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Single-chip 16-bit/32-bit ocontrollers; up to 512 kB flash with ISP/IAP, Ethernet, USB 2.0, CAN, and 10-bit ADC/DAC |
| LPC2368FET100,518 | 功能描述:ARM微控制器 - MCU 16/32 bit micro RoHS:否 制造商:STMicroelectronics 核心:ARM Cortex M4F 處理器系列:STM32F373xx 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:72 MHz 程序存儲(chǔ)器大小:256 KB 數(shù)據(jù) RAM 大小:32 KB 片上 ADC:Yes 工作電源電壓:1.65 V to 3.6 V, 2 V to 3.6 V, 2.2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:LQFP-48 安裝風(fēng)格:SMD/SMT |
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