- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄223478 > BX80539T2400 (INTEL CORP) 1830 MHz, MICROPROCESSOR, PBGA479 PDF資料下載
參數(shù)資料
| 型號： | BX80539T2400 |
| 廠商： | INTEL CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 1830 MHz, MICROPROCESSOR, PBGA479 |
| 封裝： | MICRO, FCBGA-479 |
| 文件頁數(shù)： | 86/91頁 |
| 文件大?。?/td> | 2017K |
| 代理商： | BX80539T2400 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁第76頁第77頁第78頁第79頁第80頁第81頁第82頁第83頁第84頁第85頁當前第86頁第87頁第88頁第89頁第90頁第91頁
Datasheet
87
Thermal Specifications and Design Considerations
When calculating a temperature based on thermal diode measurements, a number of
parameters must be either measured or assumed. Most devices measure the diode
ideality and assume a series resistance and ideality trim value, although some are
capable of also measuring the series resistance. Calculating the temperature is then
accomplished using the equations listed under Table 25. In most temperature sensing
devices, an expected value for the diode ideality is designed-in to the temperature
calculation equation. If the designer of the temperature sensing device assumes a
perfect diode the ideality value (also called ntrim) will be 1.000. Given that most diodes
are not perfect, the designers usually select an ntrim value that more closely matches
the behavior of the diodes in the processor. If the processors diode ideality deviates
from that of ntrim, each calculated temperature will be offset by a fixed amount. This
temperature offset can be calculated with the equation:
Terror(nf) = Tmeasured X (1 - nactual/ntrim)
Where Terror(nf) is the offset in degrees C, Tmeasured is in Kelvin, nactual is the measured
ideality of the diode, and ntrim is the diode ideality assumed by the temperature
sensing device.
5.1.2
Thermal Diode Offset
In order to improve the accuracy of diode based temperature measurements, a
temperature offset value (specified as Toffset) will be programmed into a processor
Model Specific Register (MSR) which will contain thermal diode characterization data.
During manufacturing each processors thermal diode will be evaluated for its behavior
relative to a theoretical diode. Using the equation above, the temperature error created
by the difference between ntrim and the actual ideality of the particular processor will
be calculated.
If the ntrim value used to calculate Toffset differs from the ntrim value used in a
temperature sensing device, the Terror(nf) may not be accurate. If desired, the Toffset
can be adjusted by calculating nactual and then recalculating the offset using the actual
ntrim as defined in the temperature sensor manufacturers' datasheet.
The ntrim used to calculate the Diode Correction Toffset are listed in the table below
5.1.3
Intel Thermal Monitor
The Intel Thermal Monitor helps control the processor temperature by activating the
TCC (Thermal Control Circuit) when the processor silicon reaches its maximum
operating temperature. The temperature at which the Intel Thermal Monitor activates
the TCC is not user configurable. Bus traffic is snooped in the normal manner, and
interrupt requests are latched (and serviced during the time that the clocks are on)
while the TCC is active.
With a properly designed and characterized thermal solution, it is anticipated that the
TCC would only be activated for very short periods of time when running the most
power intensive applications. The processor performance impact due to these brief
periods of TCC activation is expected to be minor and hence not detectable. An under-
designed thermal solution that is not able to prevent excessive activation of the TCC in
the anticipated ambient environment may cause a noticeable performance loss, and
may affect the long-term reliability of the processor. In addition, a thermal solution that
is significantly under designed may not be capable of cooling the processor even when
the TCC is active continuously.
Table 28.
Thermal Diode ntrim and Diode Correction Toffset
Symbol
Parameter
Value
ntrim
Diode ideality used to calculate Toffset
1.01
相關PDF資料 |
PDF描述 |
|---|---|
| BX80551PG3000FN | 32-BIT, 3000 MHz, MICROPROCESSOR, PBGA775 |
| BX805565130P | 64-BIT, MICROPROCESSOR, BGA771 |
| BX805573060 | 64-BIT, 2400 MHz, MICROPROCESSOR, CBGA775 |
| BX80562X3210SLACU | 64-BIT, 266 MHz, MICROPROCESSOR, PBGA775 |
| BX80616I5660SLBLV | 64-BIT, 133 MHz, MICROPROCESSOR, PBGA1156 |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| BX80539T2500 S L8VP | 制造商:Intel 功能描述:MPU Core? Duo Processor T2500 65nm 2GHz 1.05V 478-Pin Micro-FCPGA |
| BX80543JC1300G | 制造商:Intel 功能描述:ITANIUM 2 1.3GHZ 3M 400FSB - Boxed Product (Development Kits) |
| BX80543JC1600G | 制造商:Intel 功能描述:ITANIUM 2 1.6GHZ 3M 400FSB - Boxed Product (Development Kits) |
| BX80543KC1600K | 制造商:Intel 功能描述:ITANIUM 2 1.6GHZ 9M 400FSB - Boxed Product (Development Kits) |
| BX80546KF2833H | 制造商:Intel 功能描述:XEON MP 2.83GHZ 4MB 667FSB - Boxed Product (Development Kits) |
發(fā)布緊急采購，3分鐘左右您將得到回復。