參數(shù)資料
型號(hào)： BX80539T2400
廠商： INTEL CORP
元件分類： 微控制器/微處理器
英文描述： 1830 MHz, MICROPROCESSOR, PBGA479
封裝： MICRO, FCBGA-479
文件頁(yè)數(shù)： 23/91頁(yè)
文件大?。?/td> 2017K
代理商： BX80539T2400
Datasheet
3
Contents
1Introduction ..............................................................................................................7
Terminology .......................................................................................................9
Low Power Features ................................................................................................ 11
Clock Control and Low Power States .................................................................... 11
Core Low-Power States ........................................................................... 13
C0 State .................................................................................. 13
C1/AutoHALT Powerdown State .................................................. 13
Normal State............................................................................ 14
Stop-Grant State ...................................................................... 14
Stop Grant Snoop State ............................................................. 15
Sleep State .............................................................................. 15
Deep Sleep State ...................................................................... 16
Enhanced Intel SpeedStep Technology .............................................................. 17
Electrical Specifications ........................................................................................... 21
Power and Ground Pins ...................................................................................... 21
FSB Clock (BCLK[1:0]) and Processor Clocking...................................................... 21
Voltage Identification ......................................................................................... 21
Signal Terminations and Unused Pins ................................................................... 25
FSB Signal Groups............................................................................................. 25
CMOS Signals ................................................................................................... 27
Maximum Ratings.............................................................................................. 27
3.10 Processor DC Specifications ................................................................................ 28
Package Mechanical Specifications and Pin Information .......................................... 41
Package Mechanical Specifications ....................................................................... 41
Alphabetical Signals Reference ............................................................................ 49
Thermal Specifications and Design Considerations .................................................. 79
Thermal Specifications ....................................................................................... 85
Thermal Diode ....................................................................................... 85
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