參數(shù)資料
型號(hào)： BX80539T2400
廠商： INTEL CORP
元件分類： 微控制器/微處理器
英文描述： 1830 MHz, MICROPROCESSOR, PBGA479
封裝： MICRO, FCBGA-479
文件頁(yè)數(shù)： 84/91頁(yè)
文件大?。?/td> 2017K
代理商： BX80539T2400
Datasheet
85
Thermal Specifications and Design Considerations
5.1
Thermal Specifications
The processor incorporates three methods of monitoring die temperature, the digital
thermal sensor (DTS), Intel Thermal Monitor and the thermal diode. The Intel Thermal
Monitor (detailed in Section 5.1.3) must be used to determine when the maximum
specified processor junction temperature has been reached.
5.1.1
Thermal Diode
The processor incorporates an on-die PNP transistor whose base emitter junction is
used as a thermal diode, with its collector shorted to Ground. The thermal diode, can
be read by an off-die analog/digital converter (a thermal sensor) located on the
motherboard, or a stand-alone measurement kit. The thermal diode may be used to
monitor the die temperature of the processor for thermal management or
instrumentation purposes but is not a reliable indication that the maximum operating
temperature of the processor has been reached. When using the thermal diode, a
temperature offset value must be read from a processor Model Specific Register (MSR)
and applied. See Section 5.1.2 for more details. Please see Section 5.1.3 for thermal
diode usage recommendation when the PROCHOT# signal is not asserted.
Note:
The reading of the external thermal sensor (on the motherboard) connected to the
processor thermal diode signals, will not necessarily reflect the temperature of the
hottest location on the die. This is due to inaccuracies in the external thermal sensor,
on-die temperature gradients between the location of the thermal diode and the hottest
location on the die, and time based variations in the die temperature measurement.
Time based variations can occur when the sampling rate of the thermal diode (by the
thermal sensor) is slower than the rate at which the TJ temperature can change.
Offset between the thermal diode-based temperature reading and the Intel Thermal
Monitor reading may be characterized using the Intel Thermal Monitor’s Automatic
mode activation of thermal control circuit. This temperature offset must be taken into
account when using the processor thermal diode to implement power management
events. This offset is different than the diode Toffset value programmed into the
processor Model Specific Register (MSR).
Table 25, Table 26, Table 27, and Table 28 provide the diode interface and
specifications. Two different sets of diode parameters are listed in Table 26 and
Table 27. The Diode Model parameters (Table 26) apply to traditional thermal sensors
that use the Diode Equation to determine the processor temperature. Transistor Model
parameters (Table 27) have been added to support thermal sensors that use the
transistor equation method. The Transistor Model may provide more accurate
temperature measurements when the diode ideality factor is closer to the maximum or
minimum limits. Please contact your external thermal sensor supplier for their
recommendation. This thermal diode is separate from the Intel Thermal Monitor's
thermal sensor and cannot be used to predict the behavior of the Intel Thermal Monitor.
Table 25.
Thermal Diode Interface
Signal Name
Pin/Ball Number
Signal Description
THERMDA
A24
Thermal diode anode
THERMDC
A25
Thermal diode cathode
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