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參數(shù)資料
| 型號(hào)： | BX80539T2400 |
| 廠(chǎng)商： | INTEL CORP |
| 元件分類(lèi)： | 微控制器/微處理器 |
| 英文描述： | 1830 MHz, MICROPROCESSOR, PBGA479 |
| 封裝： | MICRO, FCBGA-479 |
| 文件頁(yè)數(shù)： | 36/91頁(yè) |
| 文件大?。?/td> | 2017K |
| 代理商： | BX80539T2400 |
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Datasheet
41
Package Mechanical Specifications and Pin Information
4
Package Mechanical
Specifications and Pin
Information
4.1
Package Mechanical Specifications
The Intel Core Duo processor and Intel Core Solo processor are available in 478-pin
Micro-FCPGA and 479-ball Micro-FCBGA packages. The package mechanical dimensions
package pin-out with their functionalities.
Warning:
The Micro-FCBGA package incorporates land-side capacitors. The land-side capacitors
are electrically conductive, care should be taken to avoid contacting the capacitors with
other electrically conductive materials on the motherboard. Doing so may short the
capacitors, and possibly damage the device or render it inactive.
4.1.1
Package Mechanical Drawings
Different views showing all pertinent dimensions of the Micro-FCPGA package are
FCBGA package are shown in Figure 9 and continued in Figure 10.
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