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參數資料
| 型號： | BX80539T2400 |
| 廠商： | INTEL CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 1830 MHz, MICROPROCESSOR, PBGA479 |
| 封裝： | MICRO, FCBGA-479 |
| 文件頁數： | 82/91頁 |
| 文件大?。?/td> | 2017K |
| 代理商： | BX80539T2400 |
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Datasheet
83
Thermal Specifications and Design Considerations
NOTES:
1.
The TDP specification should be used to design the processor thermal solution. The TDP is
not the maximum theoretical power the processor can generate.
2.
Not 100% tested. These power specifications are determined by characterization of the
processor currents at higher temperatures and extrapolating the values for the
temperature indicated.
3.
As measured by the activation of the on-die Intel Thermal Monitor. The Intel Thermal
Monitor’s automatic mode is used to indicate that the maximum TJ has been reached.
Refer to Section 5.1 for more details.
4.
The Intel Thermal Monitor automatic mode must be enabled for the processor to operate
within specification.
Table 23.
Power Specifications for the Intel Core Duo Processor, Ultra Low Voltage
(ULV)
Symbol
Processor
Number
Core Frequency
& Voltage
Thermal Design
Power
Unit
Notes
TDP
U2500
U2400
N/A
1.20 GHz & HFM VCC
1.06 GHz & HFM VCC
800 MHz & LFM VCC
9
7.5
W
At 100°C
Notes1, 4
Symbol
Parameter
Min
Typ
Max
Unit
Notes
PAH,
PSGNT
Auto Halt, Stop Grant Power
at HFM VCC
at LFM VCC
3.7
2.6
W
At 50°C
Note 2
PSLP
Sleep Power
at HFM VCC
at LFM VCC
3.6
2.5
W
At 50°C
Note 2
PDSLP
Deep Sleep Power
at HFM VCC
at LFM VCC
2.2
1.8
W
At 35°C
Note 2
PDPRSLP
Deeper Sleep Power
1.3
W
At 35°C
Note 2
PDC4
Intel Enhanced Deeper Sleep Power
1.1
W
At 35°C
Note 2
TJ
Junction Temperature
0
100
°CNotes 3, 4
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