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參數(shù)資料
| 型號： | BX80539T2400 |
| 廠商： | INTEL CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 1830 MHz, MICROPROCESSOR, PBGA479 |
| 封裝： | MICRO, FCBGA-479 |
| 文件頁數(shù)： | 41/91頁 |
| 文件大小： | 2017K |
| 代理商： | BX80539T2400 |
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Package Mechanical Specifications and Pin Information
46
Datasheet
4.1.2
Processor Component Keep-Out Zones
The processor may contain components on the substrate that define component keep-
out zone requirements. A thermal and mechanical solution design must not intrude into
the required keep-out zones. Decoupling capacitors are typically mounted in the keep-
out areas. The location and quantity of the capacitors may change, but will remain
4.1.3
Package Loading Specifications
These specifications are static compressive loading in the direction normal to the
processor. This maximum load limit should not be exceeded during shipping conditions,
standard use condition, or by thermal solution. In addition, there are additional load
limitations against transient bend, shock, and tensile loading. These limitations are
more platform specific, and should be obtained by contacting your field support.
Moreover, the processor package substrate should not be used as a mechanical
reference or load-bearing surface for thermal and mechanical solution.
4.1.4
Processor Mass Specifications
all the components that are included in the package.
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