參數(shù)資料
型號(hào)： W25Q64BVZEIP
廠商： WINBOND ELECTRONICS CORP
元件分類： PROM
英文描述： 8M X 8 SPI BUS SERIAL EEPROM, PDSO8
封裝： 8 X 6 MM, GREEN, WSON-8
文件頁數(shù)： 58/61頁
文件大?。?/td> 1726K
代理商： W25Q64BVZEIP
W25Q64BV
Publication Release Date: July 08, 2010
- 61 -
Revision E
15. REVISION HISTORY
VERSION
DATE
PAGE
DESCRIPTION
A
08/24/08
New Create Preliminary
B
01/15/09
03/12/09
3/13/09
56 & 57
57
5
13
P character added to end of a Part Number
Corrected Top Side Marking
Changed Active Current to 4mA
Typo Change QE pin to QE bit
C
08/20/09
38, 39, 54~56 &
58
44
Update Erase Suspend and Resume description.
Update Package Diagrams
UID Waveform Corrected
D
09/24/09
52
5,7,55,58,59
44
46
Change fR = 33Mhz
Added PDIP Package
Corrected Read Manufacturer / Device ID Fig 27.
Corrected Read JEDEC ID, Fig 29
E
07/08/10
61
55-58
50, 53
Removed Preliminary designator
Updated package diagrams
Updated parameter VIL/VIH, tBP1, tSE
Trademarks
Winbond and SpiFlash are trademarks of Winbond Electronics Corporation.
All other marks are the property of their respective owner.
Important Notice
Winbond products are not designed, intended, authorized or warranted for use as components in systems
or equipment intended for surgical implantation, atomic energy control instruments, airplane or spaceship
instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for
other applications intended to support or sustain life. Further more, Winbond products are not intended
for applications wherein failure of Winbond products could result or lead to a situation wherein personal
injury, death or severe property or environmental damage could occur.
Winbond customers using or selling these products for use in such applications do so at their own risk
and agree to fully indemnify Winbond for any damages resulting from such improper use or sales.
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