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參數(shù)資料
| 型號： | W25Q64BVZEIP |
| 廠商： | WINBOND ELECTRONICS CORP |
| 元件分類： | PROM |
| 英文描述： | 8M X 8 SPI BUS SERIAL EEPROM, PDSO8 |
| 封裝： | 8 X 6 MM, GREEN, WSON-8 |
| 文件頁數(shù)： | 38/61頁 |
| 文件大小： | 1726K |
| 代理商： | W25Q64BVZEIP |
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W25Q64BV
When used to release the device from the power-down state and obtain the Device ID, the instruction is
the same as previously described, and shown in figure 26, except that after /CS is driven high it must
remain high for a time duration of tRES2 (See AC Characteristics). After this time duration the device will
resume normal operation and other instructions will be accepted. If the Release from Power-down /
Device ID instruction is issued while an Erase, Program or Write cycle is in process (when BUSY equals
1) the instruction is ignored and will not have any effects on the current cycle.
Figure 25. Release Power-down/High Performance Mode Instruction Sequence
Figure 26. Release Power-down / Device ID Instruction Sequence Diagram
Publication Release Date: July 08, 2010
- 43 -
Revision E
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相關代理商/技術參數(shù) |
參數(shù)描述 |
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| W25Q64CV | 制造商:WINBOND 制造商全稱:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q64CVDAAG | 制造商:WINBOND 制造商全稱:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q64CVDAAP | 制造商:WINBOND 制造商全稱:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q64CVDAIG | 制造商:WINBOND 制造商全稱:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q64CVDAIP | 制造商:WINBOND 制造商全稱:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
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