參數(shù)資料
型號: W25Q64BVZEIP
廠商: WINBOND ELECTRONICS CORP
元件分類: PROM
英文描述: 8M X 8 SPI BUS SERIAL EEPROM, PDSO8
封裝: 8 X 6 MM, GREEN, WSON-8
文件頁數(shù): 36/61頁
文件大?。?/td> 1726K
代理商: W25Q64BVZEIP
W25Q64BV
Publication Release Date: July 08, 2010
- 41 -
Revision E
11.2.23 Power-down (B9h)
Although the standby current during normal operation is relatively low, standby current can be further
reduced with the Power-down instruction. The lower power consumption makes the Power-down
instruction especially useful for battery powered applications (See ICC1 and ICC2 in AC Characteristics).
The instruction is initiated by driving the /CS pin low and shifting the instruction code “B9h” as shown in
figure 23.
The /CS pin must be driven high after the eighth bit has been latched. If this is not done the Power-down
instruction will not be executed. After /CS is driven high, the power-down state will entered within the time
duration of tDP (See AC Characteristics). While in the power-down state only the Release from Power-
down / Device ID instruction, which restores the device to normal operation, will be recognized. All other
instructions are ignored. This includes the Read Status Register instruction, which is always available
during normal operation. Ignoring all but one instruction makes the Power Down state a useful condition
for securing maximum write protection. The device always powers-up in the normal operation with the
standby current of ICC1.
Figure 23. Deep Power-down Instruction Sequence Diagram
相關(guān)PDF資料
PDF描述
W3DG634V7D2 4M X 64 SYNCHRONOUS DRAM MODULE, DMA168
WPF512K8C70TFI5 512K X 8 FLASH 5V PROM, 70 ns, PDSO32
WPF512K8C90TRM5 512K X 8 FLASH 5V PROM, 90 ns, PDSO32
WS512K32F-35H2C 2M X 8 MULTI DEVICE SRAM MODULE, 35 ns, CHMA66
WS512K32F-45G2TC 2M X 8 MULTI DEVICE SRAM MODULE, 45 ns, CQMA68
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
W25Q64CV 制造商:WINBOND 制造商全稱:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q64CVDAAG 制造商:WINBOND 制造商全稱:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q64CVDAAP 制造商:WINBOND 制造商全稱:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q64CVDAIG 制造商:WINBOND 制造商全稱:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q64CVDAIP 制造商:WINBOND 制造商全稱:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI