參數(shù)資料
型號： ORT82G5-3BM680
廠商： LATTICE SEMICONDUCTOR CORP
元件分類： FPGA
英文描述： FPGA, 1296 CLBS, 380000 GATES, PBGA680
封裝： PLASTIC, BGA-680
文件頁數(shù)： 96/110頁
文件大?。?/td> 1459K
代理商： ORT82G5-3BM680
86
Lattice Semiconductor
Data Sheet
January 25, 2002
8b/10b SERDES Backplane Interface FPSC
ORCA ORT82G5 1.0-1.25/2.0-2.5/3.125-3.5 Gbits/s
Pin Information (continued)
Package Pinouts
Table 33 provides the package pin and pin function for the ORT82G5 FPSC and packages. The bond pad name is
identied in the PIO nomenclature used in the ORCA Foundry design editor. The Bank column provides information
as to which output voltage level bank the given pin is in. The Group column provides information as to the group of
pins the given pin is in. This is used to show which VREF pin is used to provide the reference voltage for single-
ended limited-swing I/Os. If none of these buffer types (such as SSTL, GTL, HSTL) are used in a given group, then
the VREF pin is available as an I/O pin.
When the number of FPGA bond pads exceeds the number of package pins, bond pads are unused. When the
number of package pins exceeds the number of bond pads, package pins are left unconnected (no connects).
When a package pin is to be left as a no connect for a specic die, it is indicated as a note in the device column for
the FPGA. The tables provide no information on unused pads.
As shown in the pair columns in Table 33, differential pairs and physical locations are numbered within each bank
(e.g., L19C-A0 is the nineteenth pair in an associated bank). A C indicates complementary differential, whereas a T
indicates true differential. An _A0 indicates the physical location of adjacent balls in either the horizontal or vertical
direction. Other physical indicators are as follows:
■
_A1 indicates one ball between pairs.
■
_A2 indicates two balls between pairs.
■
_D0 indicates balls are diagonally adjacent.
■
_D1 indicates balls are diagonally adjacent, separated by one physical ball.
VREF pins, shown in the Pin Description column in Table 33, are associated to the bank and group (e.g.,
VREF_TL_01 is the VREF for group one of the top left (TL) bank.
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相關代理商/技術參數(shù)
參數(shù)描述
ORT82G5-3BM680C 功能描述:FPGA - 現(xiàn)場可編程門陣列 10368 LUT 372 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
ORT82G5-3BM680C2 制造商:LATTICE 制造商全稱:Lattice Semiconductor 功能描述:0.6 to 3.7 Gbps XAUI and FC FPSCs
ORT82G5-3F680C 功能描述:FPGA - 現(xiàn)場可編程門陣列 ORCA FPSC 2.7GBITS/s BP XCVR 643K RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
ORT82G5-3FN680C 功能描述:FPGA - 現(xiàn)場可編程門陣列 ORCA FPSC 1.5V 3.7 G b Bpln Xcvr 643K Gt RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
ORT82G5-3FN680C1 功能描述:FPGA - 現(xiàn)場可編程門陣列 10368 LUT 372 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
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