參數(shù)資料
型號(hào): OL2300NHN
廠商: NXP SEMICONDUCTORS
元件分類(lèi): 通信及網(wǎng)絡(luò)
英文描述: Fractional-N PLL based transmitter
中文描述: SPECIALTY TELECOM CIRCUIT, PQCC16
封裝: 3 X 3 MM, 0.85 MM HEIGHT, LEAD FREE, PLASTIC, MO-220, SOT758-1, VQFN-16
文件頁(yè)數(shù): 41/46頁(yè)
文件大?。?/td> 951K
代理商: OL2300NHN
OL2300
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 2 — 28 October 2010
41 of 46
NXP Semiconductors
OL2300
Fractional-N PLL based transmitter
11.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
Figure 27
) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 43
and
44
Table 43.
Package thickness (mm)
Table 44.
Package thickness (mm)
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Figure 27
.
SnPb eutectic process (from J-STD-020C)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
235
220
350
220
220
< 2.5
2.5
Lead-free process (from J-STD-020C)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
260
260
250
350 to 2000
260
250
245
> 2000
260
245
245
< 1.6
1.6 to 2.5
> 2.5
相關(guān)PDF資料
PDF描述
OL2311AHN Highly Integrated Single Chip Sub 1-GHz RF Receiver
OL2381AHN Highly Integrated Single Chip Sub 1-GHz RF Transceiver
OL3216TC-DPG CERAMIC BASIC TYPE HIGH-PERFORMANCE LEDS
OLDA23TZ-WPG REFLECTOR COATING TYPE HIGH-PERFORMANCE LEDS
OLDPM8T1-L1G MOLDING TYPE SMD LED LAMPS
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
OL2300NHN/F,118 功能描述:鎖相環(huán) - PLL Fractional-N PLL Based Transmitter RoHS:否 制造商:Silicon Labs 類(lèi)型:PLL Clock Multiplier 電路數(shù)量:1 最大輸入頻率:710 MHz 最小輸入頻率:0.002 MHz 輸出頻率范圍:0.002 MHz to 808 MHz 電源電壓-最大:3.63 V 電源電壓-最小:1.71 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:QFN-36 封裝:Tray
OL2311AHN/C0B,515 功能描述:射頻接收器 Single-chip sub 1GHz RF receiver RoHS:否 制造商:Skyworks Solutions, Inc. 類(lèi)型:GPS Receiver 封裝 / 箱體:QFN-24 工作頻率:4.092 MHz 工作電源電壓:3.3 V 封裝:Reel
OL2381AHN/C0B,515 功能描述:射頻收發(fā)器 Single Chip 1-GHz 射頻收發(fā)器 RoHS:否 制造商:Atmel 頻率范圍:2322 MHz to 2527 MHz 最大數(shù)據(jù)速率:2000 Kbps 調(diào)制格式:OQPSK 輸出功率:4 dBm 類(lèi)型: 工作電源電壓:1.8 V to 3.6 V 最大工作溫度:+ 85 C 接口類(lèi)型:SPI 封裝 / 箱體:QFN-32 封裝:Tray
OL2381AHN/C0B515 制造商:Rochester Electronics LLC 功能描述: 制造商:NXP 功能描述: 制造商:NXP Semiconductors 功能描述:
OL2385AHN/00100Y 功能描述:RF WIRELESS PLATFORM UHF 制造商:nxp usa inc. 系列:- 包裝:剪切帶(CT) 零件狀態(tài):在售 類(lèi)型:TxRx + MCU 射頻系列/標(biāo)準(zhǔn):- 協(xié)議:- 調(diào)制:ASK,F(xiàn)SK 數(shù)據(jù)速率(最大值):- 功率 - 輸出:14dBm 靈敏度:-124dBm 存儲(chǔ)容量:- 串行接口:SPI,UART GPIO:12 電壓 - 電源:1.9 V ~ 5.5 V 電流 - 接收:- 電流 - 傳輸:29mA 工作溫度:-40°C ~ 85°C 封裝/外殼:48-VFQFN 裸露焊盤(pán) 標(biāo)準(zhǔn)包裝:1