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參數(shù)資料
| 型號： | MC56F8000RM |
| 廠商： | 飛思卡爾半導(dǎo)體(中國)有限公司 |
| 英文描述： | 16-bit Digital Signal Controllers |
| 中文描述： | 16位數(shù)字信號控制器 |
| 文件頁數(shù)： | 118/124頁 |
| 文件大小： | 1880K |
| 代理商： | MC56F8000RM |
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56F8013 Technical Data, Rev. 2
118
Freescale Semiconductor
Preliminary
The thermal characterization parameter is measured per JESD51-2 specification using a 40-gauge type T
thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so
that the thermocouple junction rests on the package. A small amount of epoxy is placed over the
thermocouple junction and over about 1mm of wire extending from the junction. The thermocouple wire
is placed flat against the package case to avoid measurement errors caused by cooling effects of the
thermocouple wire.
When heat sink is used, the junction temperature is determined from a thermocouple inserted at the
interface between the case of the package and the interface material. A clearance slot or hole is normally
required in the heat sink. Minimizing the size of the clearance is important to minimize the change in
thermal performance caused by removing part of the thermal interface to the heat sink. Because of the
experimental difficulties with this technique, many engineers measure the heat sink temperature and then
back-calculate the case temperature using a separate measurement of the thermal resistance of the
interface. From this case temperature, the junction temperature is determined from the junction-to-case
thermal resistance.
12.2 Electrical Design Considerations
Use the following list of considerations to assure correct operation of the 56F8013:
Provide a low-impedance path from the board power supply to each V
DD
pin on the 56F8013 and from the
board ground to each V
SS
(GND) pin
The minimum bypass requirement is to place 0.01–0.1
μ
F capacitors positioned as close as possible to the
package supply pins. The recommended bypass configuration is to place one bypass capacitor on each of
the V
DD
/V
SS
pairs, including V
DDA
/V
SSA.
Ceramic and tantalum capacitors tend to provide better
tolerances.
Ensure that capacitor leads and associated printed circuit traces that connect to the chip V
DD
and V
SS
(GND)
pins are as short as possible
Bypass the V
DD
and V
SS
with approximately 100
μ
F, plus the number of 0.1
μ
F ceramic capacitors
PCB trace lengths should be minimal for high-frequency signals
Consider all device loads as well as parasitic capacitance due to PCB traces when calculating capacitance.
This is especially critical in systems with higher capacitive loads that could create higher transient currents
in the V
DD
and V
SS
circuits.
CAUTION
This device contains protective circuitry to guard
against damage due to high static voltage or electrical
fields. However, normal precautions are advised to
avoid application of any voltages higher than
maximum-rated voltages to this high-impedance circuit.
Reliability of operation is enhanced if unused inputs are
tied to an appropriate voltage level.
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相關(guān)代理商/技術(shù)參數(shù) |
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| MC56F8002 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Digital Signal Controller |
| MC56F8002VWL | 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC DSC 28SOIC 12K Flash RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風格:SMD/SMT |
| MC56F8002VWL | 制造商:Freescale Semiconductor 功能描述:IC DSC 16BIT 12KB 32MHZ 3.6V SOIC-28 |
| MC56F8006 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Digital Signal Controller |
| MC56F8006DEMO | 功能描述:開發(fā)板和工具包 - 其他處理器 MC56F8006 DEMO BOARD RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓: |
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