參數(shù)資料
型號: HD74AC
廠商: Hitachi,Ltd.
英文描述: HD74AC Series Common Information
中文描述: HD74AC系列通用信息
文件頁數(shù): 43/52頁
文件大?。?/td> 220K
代理商: HD74AC
Design Considerations
42
4.2 Ground Bounce
Ground bounce occurs as a result of the intrinsic characteristics of the leadframes and bondwires of the
packages used to house CMOS devices. As edge rates and drive capability increase in advanced logic
families, the effects of these intrinsic electrical characteristics become more pronounced.
Figure 16 shows a simple circuit model for a device in a leadframe driving a standard test load. The
inductor L1 represents the parasitic inductance in the ground lead of the package; inductor L2 represents
the parasitic inductance in the power lead of the package; inductor L3 represents the parasitic inductance in
the output lead of the package; the resistor R1 represents the output impedance of the device output, and the
capacitor and resistor C
L
and R
L
represent the standard test load on the output of the device.
R1
L1
L2
L3
I
C
L
R
L
V
CC
Figure 16 Ground Bounce Output Model
Output Voltage
Output Current
Inductor Voltage
相關(guān)PDF資料
PDF描述
HD74ALVC162244 16-bit Buffer / Driver with 3-state Outputs(帶三態(tài)輸出的16位緩沖器/驅(qū)動器)
HD74ALVC162334 16-bit Universal Bus Driver with 3-state Outputs(帶三態(tài)輸出的16位通用總線驅(qū)動器)
HD74ALVC16244 16-bit Buffer / Driver with 3-state Outputs(帶三態(tài)輸出的16位緩沖器/驅(qū)動器)
HD74ALVC162831 1-bit to 4-bit Address Register / Driver with 3-state Outputs(三態(tài)輸出的1位-4位地址寄存器/驅(qū)動器)
HD74ALVC162834A 1-Of-8 Data Selectors/Multiplexers 16-CDIP -55 to 125
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