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參數資料
| 型號： | BX80562X3210SLACU |
| 廠商： | INTEL CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 64-BIT, 266 MHz, MICROPROCESSOR, PBGA775 |
| 封裝： | LGA-775 |
| 文件頁數： | 72/96頁 |
| 文件大?。?/td> | 1398K |
| 代理商： | BX80562X3210SLACU |
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Thermal Specifications and Design Considerations
74
Quad-Core Intel Xeon Processor 3200 Series Datasheet
The case temperature is defined at the geometric top center of the processor. Analysis
indicates that real applications are unlikely to cause the processor to consume
maximum power dissipation for sustained time periods. Intel recommends that
complete thermal solution designs target the Thermal Design Power (TDP) indicated in
Table 5-1 instead of the maximum processor power consumption. The Thermal Monitor
feature is designed to protect the processor in the unlikely event that an application
exceeds the TDP recommendation for a sustained periods of time. For more details on
the usage of this feature, refer to Section 5.2. In all cases the Thermal Monitor and
Thermal Monitor 2 feature must be enabled for the processor to remain within
specification.
Table 5-1.
Processor Thermal Specifications
Processor
Number
Core
Frequency
(GHz)
Thermal
Design
Power (W)
Extended HALT
Power (W)1
Notes:
1. Specification is at 50 °C TC and typical voltage loadline.
775_VR_
CONFIG_05B
Guidance2
2. 775_VR_CONFIG_05B guidelines provide a design target for meeting future thermal requirements.
Minimum
TC (°C)
Maximum TC
(°C)
Notes
X3220
2.40
105
50
775_VR_CONFIG
_05B
5See Table 5-2
and
3, 4
3. Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not
the maximum power that the processor can dissipate.
4. This table shows the maximum TDP for a given frequency range. Individual processors may have a lower
TDP. Therefore, the maximum TC will vary depending on the TDP of the individual processor. Refer to
thermal profile figure and associated table for the allowed combinations of power and TC.
X3210
2.13
105
50
5
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