參數(shù)資料
型號: BX80562X3210SLACU
廠商: INTEL CORP
元件分類: 微控制器/微處理器
英文描述: 64-BIT, 266 MHz, MICROPROCESSOR, PBGA775
封裝: LGA-775
文件頁數(shù): 33/96頁
文件大小: 1398K
代理商: BX80562X3210SLACU
Quad-Core Intel Xeon Processor 3200 Series Datasheet
39
Package Mechanical Specifications
3.5
Package Insertion Specifications
The processor can be inserted into and removed from a LGA775 socket 15 times. The
socket should meet the LGA775 requirements detailed in the LGA775 Socket
Mechanical Design Guide.
3.6
Processor Mass Specification
The typical mass of the processor is 21.5 g [0.76 oz]. This mass [weight] includes all
the components that are included in the package.
3.7
Processor Materials
Table 3-3 lists some of the package components and associated materials.
3.8
Processor Markings
Figure 3-5 shows the topside markings on the processor. This diagram is to aid in the
identification of the processor.
Table 3-3.
Processor Materials
Component
Material
Integrated Heat Spreader (IHS)
Nickel Plated Copper
Substrate
Fiber Reinforced Resin
Substrate Lands
Gold Plated Copper
Figure 3-5. Processor Top-Side Marking Example
ATPO
S/N
2.40GHZ/8M/1066/05B
INTEL XEON
SLxxx [COO]
i
'05 X3220
[FPO]
M
e4
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