參數(shù)資料
型號(hào)： BX80562X3210SLACU
廠商： INTEL CORP
元件分類： 微控制器/微處理器
英文描述： 64-BIT, 266 MHz, MICROPROCESSOR, PBGA775
封裝： LGA-775
文件頁(yè)數(shù)： 4/96頁(yè)
文件大?。?/td> 1398K
代理商： BX80562X3210SLACU
Introduction
12
Quad-Core Intel Xeon Processor 3200 Series Datasheet
1.1.1
Processor Terminology
Commonly used terms are explained here for clarification:
Quad-Core Intel Xeon Processor 3200 Series - Quad core processor in the FC-
LGA6 package with a 2x4 MB L2 cache.
Processor — For this document, the term processor is the generic form of the
Quad-Core Intel Xeon Processor 3200 Series. The processor is a single package
that contains one or more execution units.
Keep-out zone — The area on or near the processor that system design can not
utilize.
Processor core — Processor core die with integrated L2 cache.
LGA775 socket — The processor mates with the system board through a surface
mount, 775-land, LGA socket.
Integrated heat spreader (IHS) —A component of the processor package used
to enhance the thermal performance of the package. Component thermal solutions
interface with the processor at the IHS surface.
Retention mechanism (RM) — Since the LGA775 socket does not include any
mechanical features for heatsink attach, a retention mechanism is required.
Component thermal solutions should attach to the processor via a retention
mechanism that is independent of the socket.
FSB (Front Side Bus) — The electrical interface that connects the processor to
the chipset. Also referred to as the processor system bus or the system bus. All
memory and I/O transactions as well as interrupt messages pass between the
processor and chipset over the FSB.
Storage conditions — Refers to a non-operational state. The processor may be
installed in a platform, in a tray, or loose. Processors may be sealed in packaging or
exposed to free air. Under these conditions, processor lands should not be
connected to any supply voltages, have any I/Os biased, or receive any clocks.
Upon exposure to “free air” (that is, unsealed packaging or a device removed from
packaging material) the processor must be handled in accordance with moisture
sensitivity labeling (MSL) as indicated on the packaging material.
Functional operation — Refers to normal operating conditions in which all
processor specifications, including DC, AC, system bus, signal quality, mechanical
and thermal are satisfied.
Execute Disable Bit — The Execute Disable bit allows memory to be marked as
executable or non-executable, when combined with a supporting operating system.
If code attempts to run in non-executable memory the processor raises an error to
the operating system. This feature can prevent some classes of viruses or worms
that exploit buffer over run vulnerabilities and can thus help improve the overall
security of the system. See the Intel Architecture Software Developer's Manual
for more detailed information.
Intel 64 Architecture — An enhancement to Intel's IA-32 architecture, allowing
the processor to execute operating systems and applications written to take
advantage of the Intel 64 architecture. Further details on Intel 64 architecture and
programming model can be found in the Intel Extended Memory 64 Technology
Software Developer Guide at http://developer.intel.com/technology/
64bitextensions/.
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