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參數(shù)資料
| 型號： | BX80562X3210SLACU |
| 廠商： | INTEL CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 64-BIT, 266 MHz, MICROPROCESSOR, PBGA775 |
| 封裝： | LGA-775 |
| 文件頁數(shù)： | 27/96頁 |
| 文件大?。?/td> | 1398K |
| 代理商： | BX80562X3210SLACU |
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Quad-Core Intel Xeon Processor 3200 Series Datasheet
33
Package Mechanical Specifications
3
Package Mechanical
Specifications
The processor is packaged in a Flip-Chip Land Grid Array (FC-LGA6) package that
interfaces with the motherboard via an LGA775 socket. The package consists of a
processor core mounted on a substrate land-carrier. An integrated heat spreader (IHS)
is attached to the package substrate and core and serves as the mating surface for
processor component thermal solutions, such as a heatsink. Figure 3-1 shows a sketch
of the processor package components and how they are assembled together. Refer to
the LGA775 Socket Mechanical Design Guide for complete details on the LGA775
socket.
The package components shown in Figure 3-1 include the following:
Integrated Heat Spreader (IHS)
Thermal Interface Material (TIM)
Processor core (die)
Package substrate
Capacitors
Note:
1.
Socket and motherboard are included for reference and are not part of processor package.
3.1
Package Mechanical Drawing
The package mechanical drawings are shown in Figure 3-2 and Figure 3-3. The
drawings include dimensions necessary to design a thermal solution for the processor.
These dimensions include:
Package reference with tolerances (total height, length, width, and so forth)
IHS parallelism and tilt
Land dimensions
Top-side and back-side component keep-out dimensions
Reference datums
All drawing dimensions are in mm [in].
Figure 3-1. Processor Package Assembly Sketch
IHS
Substrate
LGA775 Socket
System Board
Capacitors
Core (die)
TIM
IHS
Substrate
LGA775 Socket
System Board
Capacitors
Core (die)
TIM
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