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參數(shù)資料
| 型號： | BX80562X3210SLACU |
| 廠商： | INTEL CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 64-BIT, 266 MHz, MICROPROCESSOR, PBGA775 |
| 封裝： | LGA-775 |
| 文件頁數(shù)： | 13/96頁 |
| 文件大?。?/td> | 1398K |
| 代理商： | BX80562X3210SLACU |
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Electrical Specifications
20
Quad-Core Intel Xeon Processor 3200 Series Datasheet
2.5.2
DC Voltage and Current Specification
Table 2-3.
Voltage and Current Specifications
Symbol
Parameter
Min
Typ
Max
Unit
Notes1, 2
Notes:
1. Unless otherwise noted, all specifications in this table are based on estimates and simulations or empirical data.
These specifications will be updated with characterized data from silicon measurements at a later date.
2. Adherence to the voltage specifications for the processor are required to ensure reliable processor operation.
VID Range
VID
0.8500
—
1.5
V
3
3. Each processor is programmed with a maximum valid voltage identification value (VID), which is set at
manufacturing and can not be altered. Individual maximum VID values are calibrated during manufacturing such
that two processors at the same frequency may have different settings within the VID range. Note this differs
from the VID employed by the processor during a power management event (Thermal Monitor 2, Enhanced Intel
SpeedStep Technology, or Extended HALT State).
VCC
Processor Number
X3220
X3210
VCC for
775_VR_CONFIG_05B
2.40 GHz
2.13 GHz
Refer to Table 2-4 and
V
4, 5, 6
4.
These voltages are targets only. A variable voltage source should exist on systems in the event that a different
voltage is required. See Section 2.3 and Table 2-1 for more information.
5. The voltage specification requirements are measured across VCC_SENSE and VSS_SENSE lands at the socket
with a 100 MHz bandwidth oscilloscope, 1.5 pF maximum probe capacitance, and 1 MΩ minimum impedance.
The maximum length of ground wire on the probe should be less than 5 mm. Ensure external noise from the
system is not coupled into the oscilloscope probe.
6.
Refer to Table 2-4 and Figure 2-1 for the minimum, typical, and maximum V
CC allowed for a given current. The
processor should not be subjected to any VCC and ICC combination wherein VCC exceeds VCC_MAX for a given
current.
VCC_BOOT
Default VCC voltage for initial power up
—
1.10
—
V
VCCPLL
PLL VCC
- 5%
1.50
+ 5%
ICC
Processor Number
X3220
X3210
ICC for
775_VR_CONFIG_05B
2.40 GHz
2.13 GHz
——
125
115
A
7
7.
ISGNT
Processor Number
X3220
X3210
ICC Stop-Grant for
775_VR_CONFIG_05B
2.40 GHz
2.13 GHz
——
125
115
A
8, 9
8. The current specified is also for AutoHALT State.
9. ICC Stop-Grant is specified at VCC_MAX.
ITCC
ICC TCC active
—
ICC
A
10
10.The maximum instantaneous current the processor will draw while the thermal control circuit is active (as
indicated by the assertion of PROCHOT#) is the same as the maximum ICC for the processor.
VTT
FSB termination voltage
(DC + AC specifications)
1.14
1.20
1.26
V
11, 12
11.VTT must be provided via a separate voltage source and not be connected to VCC. This specification is measured
at the land.
12.Baseboard bandwidth is limited to 20 MHz.
VTT_OUT_LEFT and
VTT_OUT_RIGHT
ICC
DC Current that may be drawn from
VTT_OUT_LEFT and VTT_OUT_RIGHT per pin
—
580
mA
ITT
ICC for VTT supply before VCC stable
ICC for VTT supply after VCC stable
——
8.0
7.0
A
13
ICC_VCCPLL
ICC for PLL land
—
130
mA
ICC_GTLREF
ICC for GTLREF
—
-—
200
μA
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