參數(shù)資料
型號(hào): BR1570
英文描述: WarpLink Reference Design Platform
中文描述: WarpLink參考設(shè)計(jì)平臺(tái)
文件頁數(shù): 2/24頁
文件大?。?/td> 492K
代理商: BR1570
TABLE OF CONTENTS
WarpLink Reference Design Platform
2
For More Information On This Product,
Go to: www.freescale.com
ABSTRACT...........................................................................................................................................3
INTRODUCTION...................................................................................................................................3
WarpLink 2.5 Quad Device....................................................................................................3
WarpLink Reference Design Platform Goals.........................................................................3
WarpLink Reference Design Platform Overview...................................................................4
Architectural Overview..................................................................................................4
Backplane.......................................................................................................................5
Line Card........................................................................................................................6
Switch Card....................................................................................................................6
Test Card........................................................................................................................6
DETAILED DESIGN DESCRIPTIONS.................................................................................................6
WarpLink Reference Backplane.............................................................................................6
Backplane/Chassis Design Considerations...................................................................7
WarpLink Backplane Physical Description....................................................................7
Backplane Design Rules and Layer Stackup..................................................................9
Line, Switch, and Test Cards...............................................................................................10
Daughter Cards Design Considerations.......................................................................10
Line Card and Test Card Layer Stackups.....................................................................10
WARPLINK SIGNAL INTEGRITY SIMULATION PROGRAM.......................................................11
WarpLink Gigabit Simulations.............................................................................................11
WarpLink Interconnect Impedance Profile ..........................................................................15
WarpLink Reference System Clock Simulations.................................................................16
DESCRIPTION OF PASSIVE SIGNAL INTEGRITY MEASUREMENTS.......................................17
Time Domain Reflectometry................................................................................................17
Differential Time Domain Crosstalk....................................................................................17
Eye Diagrams.......................................................................................................................17
Time Domain Test Equipment..............................................................................................18
PASSIVE MEASUREMENT RESULTS.............................................................................................18
TDR Results..........................................................................................................................18
Eye Diagram Measurement Results....................................................................................19
ACTIVE MEASUREMENT RESULTS...............................................................................................20
Test Setup............................................................................................................................20
Eye Diagrams From Slot 8 to Slot 1.....................................................................................21
Eye Diagrams From Slot 7 to Slot 1.....................................................................................21
SUMMARY AND CONCLUSIONS...................................................................................................22
ACKNOWLEDGEMENTS..................................................................................................................22
F
Freescale Semiconductor, Inc.
n
.
相關(guān)PDF資料
PDF描述
BR200A TRANSISTOR | BJT | NPN | 50V V(BR)CEO | 20A I(C) | TO-210AC
BR200B TRANSISTOR | BJT | NPN | 50V V(BR)CEO | 20A I(C) | TO-210AC
BR201A TRANSISTOR | BJT | NPN | 75V V(BR)CEO | 20A I(C) | TO-210AC
BR201B TRANSISTOR | BJT | NPN | 75V V(BR)CEO | 20A I(C) | TO-210AC
BR211-140AMO SINGLE BIDIRECTIONAL BREAKOVER DIODE|157V V(BO) MAX|1A I(S)|SOD-84
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
BR158 功能描述:橋式整流器 15A 800V RoHS:否 制造商:Vishay 產(chǎn)品:Single Phase Bridge 峰值反向電壓:1000 V 最大 RMS 反向電壓: 正向連續(xù)電流:4.5 A 最大浪涌電流:450 A 正向電壓下降:1 V 最大反向漏泄電流:10 uA 功率耗散: 最大工作溫度:+ 150 C 長(zhǎng)度:30.3 mm 寬度:4.1 mm 高度:20.3 mm 安裝風(fēng)格:Through Hole 封裝 / 箱體:SIP-4 封裝:Tube
BR158L 制造商:GOOD-ARK 制造商全稱:GOOD-ARK Electronics 功能描述:SILICON BRIDGE RECTIFIERS
BR158W 功能描述:橋式整流器 15A 800V Wire Lds RoHS:否 制造商:Vishay 產(chǎn)品:Single Phase Bridge 峰值反向電壓:1000 V 最大 RMS 反向電壓: 正向連續(xù)電流:4.5 A 最大浪涌電流:450 A 正向電壓下降:1 V 最大反向漏泄電流:10 uA 功率耗散: 最大工作溫度:+ 150 C 長(zhǎng)度:30.3 mm 寬度:4.1 mm 高度:20.3 mm 安裝風(fēng)格:Through Hole 封裝 / 箱體:SIP-4 封裝:Tube
BR15A 制造商:Cooper Wiring Devices 功能描述:
BR15A601 制造商:Veeder-Root Company 功能描述: