
Philips Semiconductors
PNX15xx Series
Volume 1 of 1
Chapter 1: Integrated Circuit Data
PNX15XX_SER_3
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 3 — 17 March 2006
1-24
5.
Power Considerations
5.1 Power Supply Sequencing
No special power sequence is required to operate the PNX15xx Series. However, in
order to guarantee that MM_CKE remains low at power up, the PNX1500 is required
to have the VDD power supply to come-up before the VCCM power supply. This is a
JEDEC DDR specication requirement.
Remark: DDR SDRAM devices power supply sequence must also be met. Refer to
the DDR SDRAM vendor specification.
5.2 Leakage current Power Consumption
Leakage current is a new variable of the advanced CMOS processes. The maximum
current leakages are:
60 mA for VDD at 85 C (case temperature)
3 mA for VCCM at 85 C (case temperature)
20 mA for VCCP at 85 C (case temperature)
The resultant power dissipation is at most 146 mW (includes the 3 different power
supplies).
5.3 Standby Power Consumption
During the standby (sleep) mode, all the clocks of the PNX1500 system are turned
off. A small amount of logic stays alive in order to wake-up the system.
V
DD
SoC Core supply voltage
1.23
1.3
1.37
V
Tambient Operating ambient temperature range.[1]
-40
-
85
C
Ψ
jt
Junction to case thermal resistance
-
6.1
-
C/W
[1]
A heat sink with a
Ψ
n of 30.6 and a Ψf of 9.35 is required, e.g. part# 374324B00035 T411, http://www.aavidthermalloy.com
Table 16: PNX1520 Operating Range and Thermal Characteristics
Symbol
Description
Minimum
Typical
Maximum
Units
Table 17: PNX1520 Maximum Operating Speeds
VLIW
CPU
TM3260
(MHz)
DDR-I
(MHz)
MMIO
(MHz)
2DDE
MBS
VLD
(MHz)
QVCP
(qvcp_out,
qvcp_proc,
Dual Edge)
(MHz)
VIP
(MHz)
FGPO
FGPI
(MHz)
DVDD
(MHz)
PCI-
XIO
(MHz)
LAN
(MHz)
AO
AI
(MHz)
SPDO
(MHz)
GPIO
(MHz)
266
183
144
115
65, 78, 54
65
81
54
33
25
20
35
108