
PowerPC 440SP Embedded Processor
64
AMCC Proprietary
Revision 1.23 - Sept 26, 2006
Data Sheet
Table 8. Package Thermal Specifications
Thermal resistance values for the PPC440SP package in a convection environment are as follows:
Parameter
Symbol
Airflow
ft/min (m/sec)
Unit
Notes
0 (0)
100 (0.51)
200 (1.02)
Junction-to-case thermal resistance
θ
JC
0.6
°C/W
1
Case-to-ambient thermal resistance (w/o heat sink)
θ
CA
15.5
13.1
11.9
°C/W
2
Range
Minimum
Maximum
Junction-to-ball (typical)
θ
JB
6.5
°C/W
3
Notes:
1. Case temperature, TC, is measured at top center of case surface with device soldered to circuit board. For this part the junction
temperature and the case temperature are essentially identical.
2. The case-to-ambient thermal resistance is measured in a JEDEC JESD51-6 standard environment; and may not accurately
predict thermal performance in production equipment environments. The operational case temperature must be maintained.
3. 6.5 °C/W is the theoretical
θ
JB using an infinite heat sink. The larger number applies to the module mounted on a 1.8 mm thick,
2P card using 1oz. copper power planes, with an effective heat transfer area of 75mm2.
Table 9. Recommended DC Operating Conditions (Sheet 1 of 3)
Device operation beyond the conditions specified is not recommended. Extended operation beyond the recommended
conditions can affect device reliability.
Parameter
Symbol
Minimum
Typical
Maximum
Unit
Notes
Logic Supply Voltage 533 MHz
VDD
+1.4
+1.5
+1.6
V
4
Logic Supply Voltage 667 MHz
VDD
+1.425
+1.5
+1.575
V
4
I/O Supply Voltage
OVDD
+3.0
+3.3
+3.6
V
4
PCI-X I/O Supply Voltage
PCI-X DDR
PxVDD
+3.0
1.425
+3.3
1.5
+3.6
1.575
V4
Voltage Reference Input for PCI-X DDR mode 2
PCIX0VRef0:1
+1.425
+1.5
+1.575
V
4
DDR1 SDRAM Supply Voltage
DDR2 SDRAM
SVDD
+2.3
1.7
+2.5 (2.6)
1.8
+2.7
1.9
V4
System PLL Supply Voltages
AxVDD
+1.4
+1.5
+1.6
V
3
PCI-X PLL Supply Voltages
APxVDD
+1.4
+1.5
+1.6
V
3
DDR1 SDRAM Reference Voltage
SVREF
+1.15
+1.25
+1.35
V
3
DDR2 SDRAM Reference Voltage
SVREF
0.49 x SVDD
0.50 x SVDD
0.51 x SVDD
V