參數(shù)資料
型號(hào)： W25Q32DWZPIP
廠商： WINBOND ELECTRONICS CORP
元件分類： PROM
英文描述： 256K X 16 SPI BUS SERIAL EEPROM, 7.5 ns, PDSO8
封裝： 6 X 5 MM, GREEN, WSON-8
文件頁數(shù)： 10/82頁
文件大?。?/td> 1155K
代理商： W25Q32DWZPIP
W25Q32DW
- 18 -
10.2 INSTRUCTIONS
The Standard/Dual/Quad SPI instruction set of the W25Q32DW consists of thirty six basic instructions
that are fully controlled through the SPI bus (see Instruction Set table1-3). Instructions are initiated with
the falling edge of Chip Select (/CS). The first byte of data clocked into the DI input provides the
instruction code. Data on the DI input is sampled on the rising edge of clock with most significant bit
(MSB) first.
The QPI instruction set of the W25Q32DW consists of twenty four basic instructions that are fully
controlled through the SPI bus (see Instruction Set table 4). Instructions are initiated with the falling edge
of Chip Select (/CS). The first byte of data clocked through IO[3:0] pins provides the instruction code.
Data on all four IO pins are sampled on the rising edge of clock with most significant bit (MSB) first. All
QPI instructions, addresses, data and dummy bytes are using all four IO pins to transfer every byte of
data with every two serial clocks (CLK).
Instructions vary in length from a single byte to several bytes and may be followed by address bytes, data
bytes, dummy bytes (don’t care), and in some cases, a combination. Instructions are completed with the
rising edge of edge /CS. Clock relative timing diagrams for each instruction are included in figures 5
through 42. All read instructions can be completed after any clocked bit. However, all instructions that
Write, Program or Erase must complete on a byte boundary (/CS driven high after a full 8-bits have been
clocked) otherwise the instruction will be ignored. This feature further protects the device from inadvertent
writes. Additionally, while the memory is being programmed or erased, or when the Status Register is
being written, all instructions except for Read Status Register will be ignored until the program or erase
cycle has completed.
10.2.1 Manufacturer and Device Identification
MANUFACTURER ID
(MF7 - MF0)
Winbond Serial Flash
EFh
Device ID
(ID7 - ID0)
(ID15 - ID0)
Instruction
ABh, 90h, 92h, 94h
9Fh
W25Q32DW
15h
6016h
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
W25Q32FVSFIG 功能描述:IC FLASH SPI 32MBIT 16SOIC RoHS:是 類別:集成電路 (IC) >> 存儲(chǔ)器 系列:SpiFlash® 標(biāo)準(zhǔn)包裝:72 系列:- 格式 - 存儲(chǔ)器:RAM 存儲(chǔ)器類型:SRAM - 同步 存儲(chǔ)容量:4.5M（256K x 18） 速度:133MHz 接口:并聯(lián) 電源電壓:3.135 V ~ 3.465 V 工作溫度:0°C ~ 70°C 封裝/外殼:100-LQFP 供應(yīng)商設(shè)備封裝:100-TQFP（14x20） 包裝:托盤
W25Q32FVSSIG 制造商:Winbond Electronics Corp 功能描述:Flash Serial-SPI 3V/3.3V 32Mbit 4M x 8bit 8.5ns 8-Pin SOIC 制造商:Winbond Electronics Corp 功能描述:32MB F VERSIOB SPI FLASH 制造商:Winbond Electronics Corp 功能描述:IC FLASH 32MBIT 104MHZ 8SOIC
W25Q32FVSSIG TR 制造商:Winbond Electronics Corp 功能描述:IC FLASH 32MBIT 104MHZ 8SOIC
W25Q32FVSSIQ 制造商:Winbond Electronics Corp 功能描述:
W25Q32FVZPIG 功能描述:IC FLASH SPI 32MBIT 8WSON RoHS:是 類別:集成電路 (IC) >> 存儲(chǔ)器 系列:SpiFlash® 標(biāo)準(zhǔn)包裝:2,500 系列:- 格式 - 存儲(chǔ)器:EEPROMs - 串行 存儲(chǔ)器類型:EEPROM 存儲(chǔ)容量:1K (128 x 8) 速度:100kHz 接口:UNI/O?（單線） 電源電壓:1.8 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-TSSOP，8-MSOP（0.118"，3.00mm 寬） 供應(yīng)商設(shè)備封裝:8-MSOP 包裝:帶卷 (TR)
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