Table 9. Thermal characteristics fo" />
參數(shù)資料
型號： TRK-MPC5634M
廠商： Freescale Semiconductor
文件頁數(shù)： 78/122頁
文件大?。?/td> 0K
描述： TRAK 5634M 144PN R2.1
設(shè)計資源： TRK-MPC5634M Schematic
標(biāo)準(zhǔn)包裝： 1
系列： MPC56xx
類型： MCU
適用于相關(guān)產(chǎn)品： MPC5634M
所含物品： 板，線纜，CD，DVD
Electrical characteristics
MPC5634M Microcontroller Data Sheet, Rev. 9
Freescale Semiconductor
59
Table 9. Thermal characteristics for 176-pin LQFP1
1 Thermal characteristics are targets based on simulation that are subject to change per device characterization.
Symbol
C
Parameter
Conditions
Value
Unit
RJA
CC
D Junction-to-Ambient, Natural Convection2
2 Junction-to-Ambient Thermal Resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board
meets JEDEC specification for this package.
Single layer board - 1s
38
°C/W
RJA
CC
D Junction-to-Ambient, Natural Convection2
Four layer board - 2s2p
31
°C/W
RJMA
CC
D Junction-to-Moving-Air, Ambient2
@200 ft./min., single layer
board - 1s
30
°C/W
RJMA
CC
D Junction-to-Moving-Air, Ambient2
@200 ft./min., four layer
board - 2s2p
25
°C/W
RJB
CC
D Junction-to-Board3
3 Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC
specification for the specified package.
20
°C/W
RJCtop
CC
D Junction-to-Case4
4 Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate
temperature is used for the case temperature. Reported value includes the thermal resistance of the interface layer.
5°C/W
JT
CC
D Junction-to-Package Top, Natural
Convection5
5 Thermal characterization parameter indicating the temperature difference between the package top and the
junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization
parameter is written as Psi-JT.
2°C/W
Table 10. Thermal characteristics for 208-pin MAPBGA1
1 Thermal characteristics are targets based on simulation that are subject to change per device characterization.
Symbol
C
Parameter
Conditions
Value
Unit
RJA
CC
D Junction-to-ambient, natural convection2,3
2 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
3 Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
One layer board - 1s
39
°C/W
RJMA
CC
D Junction-to-ambient natural convection2,4
4 Per JEDEC JESD51-6 with the board horizontal.
Four layer board - 2s2p
24
°C/W
RJA
CC
D Junction-to-ambient (@200 ft/min)2,4
Single layer board
31
°C/W
RJMA
CC
D Junction-to-ambient (@200 ft/min)2,4
Four layer board 2s2p
20
°C/W
RJB
CC
D Junction-to-board5
5
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
Four layer board - 2s2p
13
°C/W
RJC
CC
D Junction-to-case6
6 Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate
method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature.
6°C/W
JT
CC
D Junction-to-package top natural convection7
2°C/W
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