8
參數(shù)資料
型號： TRK-MPC5634M
廠商： Freescale Semiconductor
文件頁數(shù)： 77/122頁
文件大小： 0K
描述： TRAK 5634M 144PN R2.1
設(shè)計資源： TRK-MPC5634M Schematic
標(biāo)準(zhǔn)包裝： 1
系列： MPC56xx
類型： MCU
適用于相關(guān)產(chǎn)品： MPC5634M
所含物品： 板，線纜，CD，DVD
MPC5634M Microcontroller Data Sheet, Rev. 9
Electrical characteristics
Freescale Semiconductor
58
4.3
Thermal characteristics
8 Internal structures hold the voltage greater than –1.0 V if the injection current limit of 2 mA is met.
9 Internal structures hold the input voltage less than the maximum voltage on all pads powered by VDDEH supplies, if
the maximum injection current specification is met (2 mA for all pins) and VDDEH is within the operating voltage
specifications.
10 Internal structures hold the input voltage less than the maximum voltage on all pads powered by VDDE supplies, if the
maximum injection current specification is met (2 mA for all pins) and VDDE is within the operating voltage
specifications.
11 Total injection current for all pins (including both digital and analog) must not exceed 25 mA.
12 Total injection current for all analog input pins must not exceed 15 mA.
13 Lifetime operation at these specification limits is not guaranteed.
14 Solder profile per CDF-AEC-Q100.
15 Moisture sensitivity per JEDEC test method A112.
Table 8. Thermal characteristics for 144-pin LQFP
Symbol
C
Parameter
Conditions
Value
Unit
RJA
CC
D Junction-to-Ambient, Natural Convection1
1 Junction-to-Ambient Thermal Resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board
meets JEDEC specification for this package.
Single layer board – 1s
43
°C/W
RJA
CC
D Junction-to-Ambient, Natural Convection2
Four layer board – 2s2p
35
°C/W
RJMA
CC
D Junction-to-Ambient (@200 ft/min)2
Single layer board –1s
34
°C/W
RJMA
CC
D Junction-to-Ambient (@200 ft/min)2
Four layer board – 2s2p
29
°C/W
RJB
CC
D Junction-to-Board2
2 Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC
specification for the specified package.
22
°C/W
RJCtop
CC
D Junction-to-Case (Top)3
3 Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate
temperature is used for the case temperature. Reported value includes the thermal resistance of the interface layer.
8°C/W
JT
CC
D Junction-to-Package Top, Natural
Convection4
4 Thermal characterization parameter indicating the temperature difference between the package top and the
junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization
parameter is written as Psi-JT.
2°C/W
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