參數(shù)資料
型號: TMS320C6727B_07
廠商: Texas Instruments, Inc.
元件分類: 數(shù)字信號處理
英文描述: Floating-Point Digital Signal Processors
中文描述: 浮點數(shù)字信號處理器
文件頁數(shù): 110/116頁
文件大?。?/td> 999K
代理商: TMS320C6727B_07
www.ti.com
7.2.2
PowerPAD PCB Footprint
Thermal Pad on Top Copper
should be as large as Possible.
Soldermask opening should be smaller and match
the size of the thermal pad on the DSP.
7.3 Packaging Information
TMS320C6727B, TMS320C6726B, TMS320C6722B, TMS320C6720
Floating-Point Digital Signal Processors
SPRS370C–SEPTEMBER 2006–REVISED OCTOBER 2007
Texas Instruments'
PowerPAD Thermally Enhanced Package Technical Brief
(literature number
SLMA002) should be consulted when creating a PCB footprint for this device. In general, for proper
thermal performance, the thermal pad under the package body should be as large as possible. However,
the soldermask opening for the PowerPAD should be sized to match the pad size on the 144-pin RFP
package; as illustrated in
Figure 7-2
.
Figure 7-2. Soldermask Opening Should Match Size of DSP Thermal Pad
The following packaging information reflects the most current released data available for the designated
device(s). This data is subject to change without notice and without revision of this document.
On the 144-pin RFP package, the actual size of the Thermal Pad is 5.4 mm
×
5.4 mm.
Mechanical Data
110
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