參數(shù)資料
型號(hào): TMP320C40
廠商: Texas Instruments, Inc.
元件分類(lèi): 數(shù)字信號(hào)處理
英文描述: DIGITAL SIGNAL PROCESSORS
中文描述: 數(shù)字信號(hào)處理器
文件頁(yè)數(shù): 57/62頁(yè)
文件大?。?/td> 1066K
代理商: TMP320C40
4040035-2/E 03/97
1.879 (47,73)
1.841 (46,76)
SQ
TYP
0.050 (1,27) TYP
0.080 (2,03) TYP
0.150 (3,81)
0.145 (3,68)
0.200 (5,08)
DETAIL A
1.717 (43,61)
1.683 (42,75)
TYP
35
33
31
29
25 27
19 21
17
15
13
11
9
7
23
AR
AN
AL
AJ
AG
AE
AC
AA
W
U
R
N
L
J
5
3
G
E
C
A
1
0.120 (3,05)
0.165 (4,19)
0.016 (0,41)
0.020 (0,51)
0.040 (1,02)
0.006 (0,152)
0.060 (1,52)
0.026 (0,660)
0.170 (4,32)
0.190 (4,83)
0.048 (1,22) DIA 4 Places
0.050 (1,27)
0.100 (2,54)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Index mark can appear on top or bottom, depending on package vendor.
D. Pins are located within 0.010 (0,25) diameter of true position relative to
each other at maximum material condition and within
0.030 (0,76) diameter relative to the edge of the ceramic.
E. This package can be hermetically sealed with metal lids
or with ceramic lids using glass frit.
F. The pins can be gold-plated or solder-dipped.
G. Package thickness of 0.165 (4,19) / 0.120 (3,05) includes
package body and lid.
H. Falls within JEDEC MO-128AK
SGUS017H
OCTOBER 1993
REVISED OCTOBER 2001
57
POST OFFICE BOX 1443
HOUSTON, TEXAS 77251
1443
MECHANICAL DATA
GF (S-CPGA-P325)
CERAMIC PIN GRID ARRAY
Thermal Resistance
Characteristics
Parameter
°
C/W
Air Flow
LFPM
R
Θ
JC
R
Θ
JA
R
Θ
JA
R
Θ
JA
R
Θ
JA
R
Θ
JA
R
Θ
JA
1.7
N/A
10.9
0
9.8
200
7.0
400
6.4
600
5.6
800
5.5
1000
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