
S1D15G10D08B000
Rev. 1.0
EPSON
61
15. CAUTIONS
Concerning this development specification, users are advised to pay attention to the following precautions.
1. This development specification is subject to modifications without previous notice.
2. This development specification does not grant the industrial property right or any other right, or exercising such
rights.
Application examples contained in this document are intended only to help users to understand the product better.
SEIKO EPSON shall not be liable to any circuit-related problem resulted from using these examples.
Users are requested to pay attention to the following points when using S1D15G10 series.
Precautions on Light
Characteristics of semiconductor devices can be changed when exposed to light as described in the operational
principles of solar batteries. Exposing this IC to light, therefore, can potentially lead to its malfunctioning.
1
Care must be exercised in designing the operation system and mounting the IC so that it may not be exposed light
during operation
2
Care must be exercised in designing the inspection process and handling the IC so that it may not be exposed to light
during the process.
3
The IC must be shielded from light in the front, back and side faces.
Precautions on External Noises
1
Internal state of S1D15G10 can be changed when exposed to adversely affecting external factors such as excessive
noises though it can maintain the command-instructed operational status and display data. Thus, you must make
sure when mounting the IC and designing the operation system that measures for eliminating noises or measures
protecting the IC from noises are prepared.
2
In order to be prepared against sudden noise, it is recommended to prepare the software to perform periodic
refreshing of operational state (re-setting of commands and re-transfer of display data).
Precautions on Mounting COG
When mounting COG, you must take into consideration of resistance component generated across the driver chip and
externally connected parts (capacitor and resistor) resulting from ITO wiring. This resistance component can interfere
with high-speed operation of liquid crystal display or MPU.
When mounting COG, you must take into consideration of the following three points in the module design:
1. To minimize resistance between the driver chip pin to the external part.
2. To minimize resistance at the power terminal of the driver chip.
3. To develop sample COG modules with varying degrees of ITO sheet resistance in order to select one with the sheet
resistance allowing sufficient operational margins.