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參數(shù)資料
| 型號(hào)： | PNX8511 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Analog companion chip |
| 中文描述： | 模擬伴隨芯片 |
| 文件頁數(shù)： | 90/92頁 |
| 文件大小： | 3064K |
| 代理商： | PNX8511 |
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Philips Semiconductors
PNX8510/11
Analog companion chip
Product data
Rev. 04 – 12 January 2004
90 of 92
9397 750 12612
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
[3]
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reflow
soldering with peak temperature exceeding 217
°
C
±
10
°
C measured in the atmosphere of the reflow
oven. The package body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side,
the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the
heatsink on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Hot bar or manual soldering is suitable for PMFP packages.
[4]
[5]
[6]
[7]
[8]
15. Revision history
Table 50:
Rev Date
04
Revision history
CPCN
20040112
Description
Upgraded to Product data (9397 750 12612)
Modifcations to:
Section 7.6
:
Remark
amended
Section 10.4
: added
Preliminary data (9397 750 09223). Major updates to docs by Hari Tadepalli of VLSI
IC Engineering as requested format upgrade to DVP template. More detail added to:
Luminance and Chrominance Processing, Macrovision and Programming Interface.
Supersedes initial version of 27 August 2001 (9397 750 08495). The format of this
document has been redesigned to comply with Philips Semiconductors’ new
presentation and information standard.
Preliminary release posted on BHS (DVI) Intranet web site
03
20030926
02
20011008
853-2300 27221
01
20010827
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PNX8511HW/B1 | 功能描述:視頻 IC ANALOG BACKEND COMPANION RoHS:否 制造商:Fairchild Semiconductor 工作電源電壓:5 V 電源電流:80 mA 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-28 封裝:Reel |
| PNX8511HW/B1,557 | 功能描述:視頻 IC ANALOG BACKEND RoHS:否 制造商:Fairchild Semiconductor 工作電源電壓:5 V 電源電流:80 mA 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-28 封裝:Reel |
| PNX8526 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Programmable source decoder with integrated peripherals |
| PNX8526EH | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Programmable source decoder with integrated peripherals |
| PNX8932E/M101S5 LP | 制造商:Entropic 功能描述:IC |
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