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參數(shù)資料
| 型號： | PC8265A |
| 英文描述： | PC8265A [Updated 9/03. 59 Pages] |
| 中文描述： | PC8265A [更新9 / 03。 59頁] |
| 文件頁數(shù)： | 36/59頁 |
| 文件大?。?/td> | 455K |
| 代理商： | PC8265A |
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36
PC8265A PowerQUICC II
5336A–HIREL–08/03
Thermal Characteristics
Table 6 describes thermal characteristics.
Notes:
1. Assumes a single layer board with no thermal vias
2. Natural convection
3. Assumes a four layer board
4. Thermal resistance between the die and the printed circuit board per JEDEC
JESD51-8. Board temperature is measured on the top surface of the board near the
package
5. Thermal resistance between the die and the case top surface as measured by the
cold plate method (MIL SPEC-883 Method 1012.1)
Power Considerations
The average chip-junction temperature, T
J
, in
°
C can be obtained from the following:
T
J
= T
A
+ (P
D
x
Θ
JA
)
where
T
A
= ambient temperature
°
C
Θ
JA
= package thermal resistance, junction to ambient,
°
C/W
P
D
= P
INT
+ P
I/O
P
INT
= I
DD
x V
DD
Watts (chip internal power)
P
I/O
= power dissipation on input and output pins (determined by user)
For most applications P
I/O
< 0.3 x P
INT
. If P
I/O
is neglected, an approximate relationship
between P
D
and T
J
is as follows:
P
D
= K/(T
J
+ 273
°
C)
Solving equations (1) and (2) for K gives:
(1)
(2)
K = P
D
x (T
A
+ 273
°
C) +
Θ
JA
x P
D
where K is a constant pertaining to the particular part. K can be determined from equa-
tion (3) by measuring P
D
(at equilibrium) for a known T
A
. Using this value of K, the
values of P
D
and T
J
can be obtained by solving equations (1) and (2) iteratively for any
value of T
A
.
2
(3)
Table 6.
Thermal Characteristics for the 480 TBGA Package
Characteristics
Symbol
Value
Unit
Air Flow
Junction to ambient
Θ
JA
Θ
JA
Θ
JA
Θ
JA
Θ
JB
Θ
JC
13.07
(1)
°
C/W
NC
(2)
9.55
(1)
°
C/W
1 m/s
10.48
(3)
°
C/W
NC
7.78
(3)
°
C/W
1 m/s
Junction to board
(4)
6
°
C/W
–
Junction to case
(5)
2
°
C/W
–
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