參數(shù)資料
型號: PC8240
廠商: Atmel Corp.
英文描述: Integrated Processor Family
中文描述: 綜合處理器系列
文件頁數(shù): 10/42頁
文件大?。?/td> 421K
代理商: PC8240
10
PC8240
2149A–HIREL–05/02
Figure 3 shows the undershoot and overshoot voltage of the memory interface of the
PC8240.
Figure 3.
Overshoot/Undershoot Voltage
Thermal Information
Thermal Characteristics
Thermal Management
Information
This section provides thermal management information for the tape ball grid array
(TBGA) package for air-cooled applications. Proper thermal control design is primarily
dependent upon the system-level design, the heat sink, airflow and thermal interface
material. To reduce the die-junction temperature, heat sinks may be attached to the
package by several methods-adhesive, spring clip to holes in the printed-circuit board or
package, and mounting clip and screw assembly; see Figure 4.
Figure 4.
Package Exploded Cross-Sectional View with Several Heat Sink Options
Gnd
Gnd ± 0.3V
Gnd ± 1.0V
Not to exceed 10%
of tSDRAM_CLK
GVdd
GVdd + 5%
4V
VIH
VIL
Table 4.
Package Thermal Characteristics
Symbol
Characteristic
Min
Unit
θ
JC
θ
JB
Die Junction-to-Case Thermal Resistance
1.8
°
C/W
Die Junction-to-Board Thermal Resistance
4.8
°
C/W
Adhesive
or
Thermal Interface
Material
Die
Heat Sink
TBGA Package
Heat Sink
Clip
Printed-Circuit Board
Option
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