參數(shù)資料
型號： MSC8144
廠商： 飛思卡爾半導(dǎo)體(中國)有限公司
元件分類： 數(shù)字信號處理
英文描述： Quad Core Digital Signal Processor
中文描述： 四核心數(shù)字信號處理器
文件頁數(shù)： 28/80頁
文件大?。?/td> 1146K
代理商： MSC8144
MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
Electrical Characteristics
Freescale Semiconductor
28
2.4
Table 5
describes thermal characteristics of the MSC8144 for the FC-PBGA packages.
Thermal Characteristics
Section 3.5
,
Thermal Considerations
provides a detailed explanation of these characteristics.
2.5
The estimated typical power dissipation for MSC8144 versus the core frequency is shown in
Table 6
.
Power Characteristics
Table 5. Thermal Characteristics for the MSC8144
Characteristic
Symbol
FC-PBGA
29
×
29 mm
5
Unit
Natural
Convection
200 ft/min
(1 m/s) airflow
Junction-to-ambient
1, 2
Junction-to-ambient, four-layer board
1, 3
Junction-to-board (bottom)
4
Junction-to-case
5
R
θ
JA
R
θ
JA
R
θ
JB
R
θ
JC
20
15
°C/W
15
12
°C/W
7
°C/W
0.8
°C/W
Notes:
1.
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
Per JEDEC JESD51-2 with the single layer board (JESD51-3) horizontal.
Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.
Thermal resistance between the die and the printed circuit board per JEDEC JESD 51-8. Board temperature is measured on
the top surface of the board near the package.
Thermal resistance between the active surface of the die and the case top surface determined by the cold plate method (MIL
SPEC-883 Method 1012.1) with the calculated case temperature.
2.
3.
4.
5.
Table 6. Power Dissipation
Extended Core Frequency
Core Frequency
Typical
Unit
266
400
TBD
W
533
TBD
667
TBD
800
TBD
333
500
TBD
W
667
TBD
833
TBD
1000
TBD
400
400
TBD
W
600
TBD
800
TBD
1000
TBD
500
500
TBD
W
750
TBD
1000
TBD
Note:
Measured for 1.0 V core at 25°C junction temperature.
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