參數(shù)資料
型號(hào)： MPC8544VTARJ
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 533 MHz, MICROPROCESSOR, PBGA783
封裝： 29 X 29 MM, 1 MM PITCH, LEAD FREE, PLASTIC, FC-PBGA-783
文件頁數(shù)： 104/112頁
文件大?。?/td> 1294K
代理商： MPC8544VTARJ
MPC8544E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 0
Freescale Semiconductor
91
Thermal
20 Thermal
This section describes the thermal specifications of the MPC8544E.
20.1
Thermal Characteristics
Table 70 provides the package thermal characteristics.
Table 71 provides the thermal resistance with heat sink in open flow.
Simulations with heat sinks were done with the package mounted on the 2s2p thermal test board. The
thermal interface material was a typical thermal grease such as Dow Corning 340 or Wakefield 120 grease.
For system thermal modeling, the MPC8544E thermal model without a lid is shown in Figure 49. The
Table 70. Package Thermal Characteristics
Characteristic
JEDEC Board
Symbol
Value
Unit
Notes
Junction-to-ambient natural convection
Single layer board (1s)
RθJA
26
°C/W
1, 2
Junction-to-ambient natural convection
Four layer board (2s2p)
RθJA
21
°C/W
1, 2
Junction-to-ambient (@200 ft/min)
Single layer board (1s)
RθJA
21
°C/W
1, 2
Junction-to-ambient (@200 ft/min)
Four layer board (2s2p)
RθJA
17
°C/W
1, 2
Junction-to-board thermal
—
RθJB
12
°C/W
3
Junction-to-case thermal
—
RθJC
<0.1
°C/W
4
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal
resistance.
2. Per JEDEC JESD51-2 and JESD51-6 with the board (JESD51-9) horizontal.
3. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
4. Thermal resistance between the active surface of the die and the case top surface determined by the cold plate method (MIL
SPEC-883 Method 1012.1) with the calculated case temperature. Actual thermal resistance is less than 0.1
°C/W.
Table 71. Thermal Resistance with Heat Sink in Open Flow
Heat Sink with Thermal Grease
Air Flow
Thermal Resistance
(
°C/W)
Wakefield 53
× 53 × 25 mm pin fin
Natural convection
6.1
Wakefield 53
× 53 × 25 mm pin fin
1 m/s
3.0
Aavid 35
× 31 × 23 mm pin fin
Natural convection
8.1
Aavid 35
× 31 × 23 mm pin fin
1 m/s
4.3
Aavid 30
× 30 × 9.4 mm pin fin
Natural convection
11.6
Aavid 30
× 30 × 9.4 mm pin fin
1 m/s
6.7
Aavid 43
× 41 × 16.5 mm pin fin
Natural convection
8.3
Aavid 43
× 41 × 16.5 mm pin fin
1 m/s
4.3
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