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參數(shù)資料
| 型號： | MPC603E7TED |
| 廠商： | Motorola, Inc. |
| 英文描述： | PowerPC 603e RISC Microprocessor |
| 中文描述： | RISC微處理器的PowerPC 603e |
| 文件頁數(shù)： | 31/36頁 |
| 文件大小： | 551K |
| 代理商： | MPC603E7TED |
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PID7t-603e Hardware Specifications
For More Information On This Product,
Go to: www.freescale.com
31
System Design Information
Loctite Corporation
1001 Trout Brook Crossing
Rocky Hill, CT 06067-3910
Internet: www.loctite.com
860-571-5100
1.8.6.3 Heat Sink Selection Example
For preliminary heat sink sizing, the die-junction temperature can be expressed as follows:
T
j
= T
a
+ T
r
+ (
q
jc
+
q
int
+
q
sa
) * P
d
Where
:
T
j
is the die-junction temperature
T
a
is the inlet cabinet ambient temperature
T
r
is the air temperature rise within the computer cabinet
q
jc
is the die junction-to-case thermal resistance
q
int
is the adhesive or interface material thermal resistance
q
sa
is the heat sink base-to-ambient thermal resistance
P
d
is the power dissipated by the device
During operation the die-junction temperatures (T
j
) should be maintained less than the value speciTed in
Table 3. The temperature of the air cooling the component greatly depends upon the ambient inlet air
temperature and the air temperature rise within the electronic cabinet. An electronic cabinet inlet-air
temperature (T
a
) may range from 30 to 40 C. The air temperature rise within a cabinet (T
r
) may be in the
range of 5 to 10 C. The thermal resistance of the thermal interface material (
q
int
) is typically about 1 C/W.
Assuming a T
a
of 30 C, a T
r
of 5 C a CBGA package
q
jc
=
0.095
, and a power consumption (P
d
) of 3.0
Watts, the following expression for T
j
is obtained:
Die-junction temperature: T
j
= 30 C + 5 C + (0.095 C/W + 1.0 C/W + R
sa
) * 3.0 W
For a Thermalloy heat sink #2328B, the heat sink-to-ambient thermal resistance (R
sa
) versus airow
velocity is shown in Figure 18.
F
Freescale Semiconductor, Inc.
n
.
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