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參數(shù)資料
| 型號： | MPC603E7TED |
| 廠商： | Motorola, Inc. |
| 英文描述： | PowerPC 603e RISC Microprocessor |
| 中文描述： | RISC微處理器的PowerPC 603e |
| 文件頁數(shù)： | 26/36頁 |
| 文件大?。?/td> | 551K |
| 代理商： | MPC603E7TED |
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PID7t-603e Hardware Specifications
System Design Information
Figure 14. Typical Die Junction-to-Ambient Thermal Resistance
(21 mm CBGA and 23 mm WB-PBGA)
To reduce the die-junction temperature, heat sinks may be attached to the package by several
methodsadhesive, spring clip to holes in the printed-circuit board or package, and mounting clip and
screw assembly (both CBGA and PGBA packages); see Figure 15. Caution: please note, when choosing a
heat sink attachment method, any attachment mechanism should not degrade the package structural integrity
and/or the package-to-board interconnect reliability. For additional general information, see this
paper--Investigation of Heat Sink Attach Methodologies and the Effects on Package Structural Integrity and
Interconnect Reliability.
Airflow Velocity (m/s)
0
5
10
15
20
25
30
35
40
0
0.5
1
1.5
2
Typical Lower Limit
Typical Upper Limit
F
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
.
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