參數(shù)資料
型號(hào): MPC603E7TED
廠商: Motorola, Inc.
英文描述: PowerPC 603e RISC Microprocessor
中文描述: RISC微處理器的PowerPC 603e
文件頁(yè)數(shù): 15/36頁(yè)
文件大?。?/td> 551K
代理商: MPC603E7TED
PID7t-603e Hardware Specifications
For More Information On This Product,
Go to: www.freescale.com
15
Pin Assignments
1.5 Pin Assignments
P
art A of Figure 9 shows the pinout of the CBGA package as viewed from the top surface. Part B
shows the side profile of the CBGA package to indicate the direction of the top surface view. The
PBGA package has an identical pinout. Part C shows the side profile of the PBGA package to
indicate the direction of the top surface view.
Part A
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16
Not to Scale
Part B
Substrate Assembly
Encapsulant
View
Die
F
Freescale Semiconductor, Inc.
n
.
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