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| 型號(hào)： | M-ORSO82G52BM680-DB |
| 廠商： | LATTICE SEMICONDUCTOR CORP |
| 元件分類： | FPGA |
| 英文描述： | FPGA, 1296 CLBS, 333000 GATES, PBGA680 |
| 封裝： | PLASTIC, FBGA-680 |
| 文件頁(yè)數(shù)： | 21/123頁(yè) |
| 文件大?。?/td> | 2207K |
| 代理商： | M-ORSO82G52BM680-DB |
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Lattice Semiconductor
ORCA ORSO82G5 Data Sheet
117
Package Information
Package Thermal Characteristics Summary
There are three thermal parameters that are in common use: θJA, ψJC, and θJC. It should be noted that all the
parameters are affected, to varying degrees, by package design (including paddle size) and choice of materials,
the amount of copper in the test board or system board, and system airow.
θJA
This is the thermal resistance from junction to ambient (theta-JA, R-theta, etc.):
where TJ is the junction temperature, TA, is the ambient air temperature, and Q is the chip power.
Experimentally, θJA is determined when a special thermal test die is assembled into the package of interest, and
the part is mounted on the thermal test board. The diodes on the test chip are separately calibrated in an oven. The
package/board is placed either in a JEDEC natural convection box or in the wind tunnel, the latter for forced con-
vection measurements. A controlled amount of power (Q) is dissipated in the test chip’s heater resistor, the chip’s
temperature (TJ) is determined by the forward drop on the diodes, and the ambient temperature (TA) is noted. Note
that θJA is expressed in units of °C/W.
ψJC
This JEDEC designated parameter correlates the junction temperature to the case temperature. It is generally
used to infer the junction temperature while the device is operating in the system. It is not considered a true thermal
resistance and it is dened by:
where TC is the case temperature at top dead center, TJ is the junction temperature, and Q is the chip power. Dur-
ing the θJA measurements described above, besides the other parameters measured, an additional temperature
reading, TC, is made with a thermocouple attached at top-dead-center of the case.
ψJC is also expressed in units
of °C/W.
θJC
This is the thermal resistance from junction to case. It is most often used when attaching a heat sink to the top of
the package. It is dened by:
The parameters in this equation have been dened above. However, the measurements are performed with the
case of the part pressed against a water-cooled heat sink to draw most of the heat generated by the chip out the
top of the package. It is this difference in the measurement process that differentiates θJC from ψJC. θJC is a true
thermal resistance and is expressed in units of °C/W.
ΘJA
TJ TA
–
Q
-------------------
=
ψJC
TJ TC
–
Q
-------------------
=
ΘJC
TJ TC
–
Q
-------------------
=
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