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參數(shù)資料
| 型號： | LPC2919 |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類： | 32位微控制器 |
| 英文描述： | ARM9 microcontroller with CAN and LIN |
| 中文描述： | 具有CAN和LIN的ARM9微控制器 |
| 文件頁數(shù)： | 60/68頁 |
| 文件大?。?/td> | 384K |
| 代理商： | LPC2919 |
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LPC2917_19_1
NXP B.V. 2007. All rights reserved.
Preliminary data sheet
Rev. 1.01 — 15 November 2007
60 of 68
NXP Semiconductors
LPC2917/19
ARM9 microcontroller with CAN and LIN
Table 32.
Package thickness (mm)
Table 33.
Package thickness (mm)
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Figure 16
.
For further information on temperature profiles, refer to Application Note
AN10365
“Surface mount reflow soldering description”
.
14.3.2
Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.
SnPb eutectic process (from J-STD-020C)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
235
220
≥
350
220
220
< 2.5
≥
2.5
Lead-free process (from J-STD-020C)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
260
260
250
350 to 2000
260
250
245
> 2000
260
245
245
< 1.6
1.6 to 2.5
> 2.5
MSL: Moisture Sensitivity Level
Fig 16. Temperature profiles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| LPC2919/01 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:ARM9 microcontroller with CAN and LIN |
| LPC2919FBD144 | 制造商:NXP Semiconductors 功能描述:IC MCU 32BIT ARM968 SMD LQFP144 |
| LPC2919FBD144,551 | 功能描述:ARM微控制器 - MCU ARM968 768K FL/48K RAM LIN 2.0 RoHS:否 制造商:STMicroelectronics 核心:ARM Cortex M4F 處理器系列:STM32F373xx 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:72 MHz 程序存儲器大小:256 KB 數(shù)據(jù) RAM 大小:32 KB 片上 ADC:Yes 工作電源電壓:1.65 V to 3.6 V, 2 V to 3.6 V, 2.2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:LQFP-48 安裝風格:SMD/SMT |
| LPC2919FBD144/01 | 制造商:NXP Semiconductors 功能描述:MCU, 32BIT, ARM968E-S, 125MHZ, LQFP-144 制造商:NXP Semiconductors 功能描述:MCU, 32BIT, ARM968E-S, 125MHZ, LQFP-144, Controller Family/Series:LPC2900, Core Size:32bit, No. of I/O's:108, Supply Voltage Min:1.71V, Supply Voltage Max:1.89V, Digital IC Case Style:LQFP, No. of Pins:144, Program Memory Size:768KB, |
| LPC2919FBD144/01/ | 制造商:NXP Semiconductors 功能描述:MCU ARM9 144LQFP |
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