參數(shù)資料
型號： LPC2919
廠商： NXP Semiconductors N.V.
元件分類： 32位微控制器
英文描述： ARM9 microcontroller with CAN and LIN
中文描述： 具有CAN和LIN的ARM9微控制器
文件頁數(shù)： 59/68頁
文件大?。?/td> 384K
代理商： LPC2919
DRAFTDRAFTDRAFTDRAFTDRAFTDRAFTD
LPC2917_19_1
NXP B.V. 2007. All rights reserved.
Preliminary data sheet
Rev. 1.01 — 15 November 2007
59 of 68
NXP Semiconductors
LPC2917/19
ARM9 microcontroller with CAN and LIN
14. Soldering
14.1 Introduction
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is recommended.
14.2 Through-hole mount packages
14.2.1
Soldering by dipping or by solder wave
Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250
°
C
or 265
°
C, depending on solder material applied, SnPb or Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic
body must not exceed the specified maximum storage temperature (T
stg(max)
). If the
printed-circuit board has been pre-heated, forced cooling may be necessary immediately
after soldering to keep the temperature within the permissible limit.
14.2.2
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is
less than 300
°
C it may remain in contact for up to 10 seconds. If the bit temperature is
between 300
°
C and 400
°
C, contact may be up to 5 seconds.
14.3 Surface mount packages
14.3.1
Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
Figure 16
) than a PbSn process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 32
and
33
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
LPC2919/01 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:ARM9 microcontroller with CAN and LIN
LPC2919FBD144 制造商:NXP Semiconductors 功能描述:IC MCU 32BIT ARM968 SMD LQFP144
LPC2919FBD144,551 功能描述:ARM微控制器 - MCU ARM968 768K FL/48K RAM LIN 2.0 RoHS:否 制造商:STMicroelectronics 核心:ARM Cortex M4F 處理器系列:STM32F373xx 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:72 MHz 程序存儲器大小:256 KB 數(shù)據(jù) RAM 大小:32 KB 片上 ADC:Yes 工作電源電壓:1.65 V to 3.6 V, 2 V to 3.6 V, 2.2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:LQFP-48 安裝風(fēng)格:SMD/SMT
LPC2919FBD144/01 制造商:NXP Semiconductors 功能描述:MCU, 32BIT, ARM968E-S, 125MHZ, LQFP-144 制造商:NXP Semiconductors 功能描述:MCU, 32BIT, ARM968E-S, 125MHZ, LQFP-144, Controller Family/Series:LPC2900, Core Size:32bit, No. of I/O's:108, Supply Voltage Min:1.71V, Supply Voltage Max:1.89V, Digital IC Case Style:LQFP, No. of Pins:144, Program Memory Size:768KB,
LPC2919FBD144/01/ 制造商:NXP Semiconductors 功能描述:MCU ARM9 144LQFP
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