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參數(shù)資料
| 型號： | KXPC8240LVV200E |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 38/52頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC MPU INTEGRATED 250MHZ 352TBGA |
| 標(biāo)準(zhǔn)包裝： | 2 |
| 系列： | MPC82xx |
| 處理器類型： | 32-位 MPC82xx PowerQUICC II |
| 速度： | 200MHz |
| 電壓： | 2.5V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 352-LBGA |
| 供應(yīng)商設(shè)備封裝： | 352-TBGA（35x35） |
| 包裝： | 托盤 |
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MPC8240 Integrated Processor Hardware Specifications
43
System Design Information
graphite/oil, floroether oil), a bare joint, and a joint with thermal grease as a function of contact pressure.
As shown, the performance of these thermal interface materials improves with increased contact pressure.
The use of thermal grease significantly reduces the interface thermal resistance, that is, the bare joint results
in a thermal resistance approximately seven times greater than that of the thermal grease joint.
Heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board (see
Figure 26). Therefore, the synthetic grease offers the best thermal performance, considering the low
interface pressure. Of course, the selection of any thermal interface material depends on many factors:
thermal performance requirements, manufacturability, service temperature, dielectric properties, cost, and
so on.
Figure 29. Thermal Performance of Select Thermal Interface Material
The board designer can choose between several types of thermal interfaces. Heat sink adhesive materials
should be selected based on high conductivity and yet adequate mechanical strength to meet equipment
shock/vibration requirements. The following venders provide several commercially-available thermal
interfaces and adhesive materials:
Chomerics, Inc.
781-935-4850
77 Dragon Ct.
Woburn, MA 01888-4014
Internet: www.chomerics.com
Dow-Corning Corporation
800-248-2481
Dow-Corning Electronic Materials
2200 W. Salzburg Rd.
Midland, MI 48686-0997
Internet: www.dow.com
0
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102030405060
7080
Silicone Sheet (0.006 in.)
Bare Joint
Floroether Oil Sheet (0.007 in.)
Graphite/Oil Sheet (0.005 in.)
Synthetic Grease
Contact Pressure (psi)
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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| KXPC8240LZU200E | 制造商:Freescale Semiconductor 功能描述: |
| KXPC8240RVV250E | 功能描述:IC MPU INTEGRATED 250MHZ 352TBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC82xx 標(biāo)準(zhǔn)包裝:1 系列:MPC85xx 處理器類型:32-位 MPC85xx PowerQUICC III 特點:- 速度:1.2GHz 電壓:1.1V 安裝類型:表面貼裝 封裝/外殼:783-BBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:783-FCPBGA（29x29） 包裝:托盤 |
| KXPC8250AZUPHBA | 制造商:Motorola Inc 功能描述: |
| KXPC8255CVVIFBC | 功能描述:微處理器 - MPU PQ 2 HIP 3 NO-PB RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| KXPC8255CZUIFBC | 功能描述:微處理器 - MPU POWERQUICC II HIP3 REV C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
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