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| 型號： | KXPC8240LVV200E |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 37/52頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC MPU INTEGRATED 250MHZ 352TBGA |
| 標(biāo)準包裝： | 2 |
| 系列： | MPC82xx |
| 處理器類型： | 32-位 MPC82xx PowerQUICC II |
| 速度： | 200MHz |
| 電壓： | 2.5V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 352-LBGA |
| 供應(yīng)商設(shè)備封裝： | 352-TBGA（35x35） |
| 包裝： | 托盤 |
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42
MPC8240 Integrated Processor Hardware Specifications
System Design Information
Tyco Electronics
800-522-6752
Chip Coolers
P.O. Box 3668
Harrisburg, PA 17105-3668
Internet: www.chipcoolers.com
Wakefield Engineering
603-635-5102
33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com
Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal
performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost.
1.7.8.1
Internal Package Conduction Resistance
The intrinsic conduction thermal resistance paths for the TBGA, cavity-down, packaging technology shown
in Figure 26 are as follows:
The die junction-to-case thermal resistance
The die junction-to-ball thermal resistance
Figure 28 depicts the primary heat transfer path for a package with an attached heat sink mounted to a
printed-circuit board.
Figure 28. TBGA Package with Heat Sink Mounted to a Printed-Circuit Board
For this cavity-down, wire-bond TBGA package, heat generated on the active side of the chip is conducted
through the silicon, die attach, and package spreader, through the heat sink attach material (or thermal
interface material), and finally to the heat sink, where it is removed by forced-air convection.
1.7.8.2
Adhesives and Thermal Interface Materials
A thermal interface material is recommended at the package lid-to-heat sink interface to minimize thermal
contact resistance. For those applications where the heat sink is attached by a spring clip mechanism,
Figure 29 shows the thermal performance of three thin-sheet thermal-interface materials (silicone,
External Resistance
Internal Resistance
Radiation
Convection
Radiation
Convection
Heat Sink
Printed-Circuit Board
Thermal Interface Material
Package/Leads
Die Junction
Die/Package
(Note the internal versus external package resistance.)
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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| KXPC8240LZU200E | 制造商:Freescale Semiconductor 功能描述: |
| KXPC8240RVV250E | 功能描述:IC MPU INTEGRATED 250MHZ 352TBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC82xx 標(biāo)準包裝:1 系列:MPC85xx 處理器類型:32-位 MPC85xx PowerQUICC III 特點:- 速度:1.2GHz 電壓:1.1V 安裝類型:表面貼裝 封裝/外殼:783-BBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:783-FCPBGA（29x29） 包裝:托盤 |
| KXPC8250AZUPHBA | 制造商:Motorola Inc 功能描述: |
| KXPC8255CVVIFBC | 功能描述:微處理器 - MPU PQ 2 HIP 3 NO-PB RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| KXPC8255CZUIFBC | 功能描述:微處理器 - MPU POWERQUICC II HIP3 REV C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
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