參數(shù)資料
型號(hào)： KXPC8240LVV200E
廠商： Freescale Semiconductor
文件頁(yè)數(shù)： 3/52頁(yè)
文件大?。?/td> 0K
描述： IC MPU INTEGRATED 250MHZ 352TBGA
標(biāo)準(zhǔn)包裝： 2
系列： MPC82xx
處理器類(lèi)型： 32-位 MPC82xx PowerQUICC II
速度： 200MHz
電壓： 2.5V
安裝類(lèi)型： 表面貼裝
封裝/外殼： 352-LBGA
供應(yīng)商設(shè)備封裝： 352-TBGA（35x35）
包裝： 托盤(pán)
MPC8240 Integrated Processor Hardware Specifications
11
Electrical and Thermal Characteristics
1.4.1.5
Power Characteristics
Table 5 provides power consumption data for the MPC8240.
1.4.2
AC Electrical Characteristics
This section provides the AC electrical characteristics for the MPC8240. After fabrication, functional parts
are sorted by maximum processor core frequency as shown in Table 6 and tested for conformance to the AC
specifications for that frequency. The processor core frequency is determined by the bus (PCI_SYNC_IN)
Table 5. Preliminary Power Consumption
Mode
PCI Bus Clock/Memory Bus Clock
CPU Clock Frequency (MHz)
Unit
Notes
33/66/166
33/66/200
33/100/200
66/100/200
Typical
2.5
2.8
3.0
W
1, 5
Maximum—FP
2.9
3.3
3.5
W
1, 2
Maximum—INT
2.6
2.9
3.2
3.3
W
1, 3
Doze
1.8
1.9
2.1
W
1, 4, 6
Nap
667
858
mW
1, 4, 6
Sleep
477
762
mW
1, 4, 6
I/O Power Supplies
Mode
Min
Max
Unit
Notes
Typical—OVDD
200
600
mW
7, 8
Typical—GVDD
300
900
mW
7, 9
Notes:
1. The values include VDD, AVDD, AVDD2, and LAVDD but do not include I/O supply power; see Section 1.7.2, “Power
Supply Sizing,” for information on OVDD and GVDD supply power. One DIMM is used for memory loading.
2. Maximum—FP power is measured at VDD = 2.5 V with dynamic power management enabled while running an
entirely cache-resident, looping, floating-point multiplication instruction.
3. Maximum—INT power is measured at VDD = 2.5 V with dynamic power management enabled while running entirely
cache-resident, looping, integer instructions.
4. Power saving mode maximums are measured at VDD = 2.5 V while the device is in doze, nap, or sleep mode.
5. Typical power is measured at VDD = AVDD = 2.5 V, OVDD = 3.3 V where a nominal FP value, a nominal INT value,
and a value where there is a continuous flush of cache lines with alternating ones and zeros on 64-bit boundaries
to local memory are averaged.
6. Power saving mode data measured with only two PCI_CLKs and two SDRAM_CLKs enabled.
7. The typical minimum I/O power values were results of the MPC8240 performing cache resident integer operations
at the slowest frequency combination of 33:66:166 (PCI:Mem:CPU) MHz.
8. The typical maximum OVDD value resulted from the MPC8240 operating at the fastest frequency combination of
66:100:250 (PCI:Mem:CPU) MHz and performing continuous flushes of cache lines with alternating ones and
zeros to PCI memory.
9. The typical maximum GVDD value resulted from the MPC8240 operating at the fastest frequency combination of
66:100:250 (PCI:Mem:CPU) MHz and performing continuous flushes of cache lines with alternating ones and
zeros on 64-bit boundaries to local memory.
10.Power consumption on the PLL supply pins (AVDD and AVDD2) and the DLL supply pin (LAVDD) less than15 mW.
This parameter is guaranteed by design and is not tested.
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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