
21
Absolute Maximum Ratings
Thermal Information
Supply Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +3.8V
Input, Output or I/O Voltage. . . . . . . . . . . .GND -0.5V to V
CC
+0.5V
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class I
Operating Conditions
Voltage Range Core, V
CCC
. . . . . . . . . . . . . . . . . . . .+2.4V to +2.6V
Voltage Range I/O, V
CCCIO
(Note 2). . . . . . . . . . .+3.15V to +3.45V
Temperature Range
Industrial. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40
o
C to 85
o
C
Input Low Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0V to +0.8V
Input High Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to V
CC
Thermal Resistance (Typical, Notes 1, 3)
196 Lead BGA Package. . . . . . . . . . . . . . . . . . . . . .
w/200 LFM Air Flow . . . . . . . . . . . . . . . . . . . . . . . . .
w/400 LFM Air Flow . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum Package Power Dissipation at 85
o
C
196 Lead BGA Package. . . . . . . . . . . . . . . . . . . . . . . . . . . .1.97W
Maximum Storage Temperature Range. . . . . . . . . . -65
o
C to 150
o
C
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . 150
o
C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300
o
C
θ
JA
(
o
C/W)
33
29
27
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1.
θ
JA
is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech
Brief TB379.
2. Single supply operation of both the core VCCC and I/O VCCIO at 2.5V is allowed. Degradation of the I/O timing should be expected.
3. Tie 196CABGA package rows F, G, H, and J pins 6-9 to heat sink or ground to ensure maximum device heat dissipation.
DC Electrical Specifications
V
CCC
= 2.5 ± 5%, V
CCIO
= 3.3
±
5%, T
A
= -40
o
C to 85
o
C
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
MAX
UNITS
Logical One Input Voltage
V
IH
V
CCC
= 2.6V, V
CCIO
= 3.45V
2.0
-
V
Logical Zero Input Voltage
V
IL
V
CCC
= 2.4V, V
CCIO
= 3.15V
-
0.8
V
Clock Input High
V
IHC
V
CCC
= 2.6V, V
CCIO
= 3.45V
2.0
-
V
Clock Input Low
V
IHL
V
CCC
= 2.4V, V
CCIO
= 3.15V
-
0.8
V
Output High Voltage
V
OH
I
OH
= -2mA, V
CCC
= 2.4V, V
CCIO
= 3.15V
2.6
-
V
Output Low Voltage
V
OL
I
OL
= 2mA, V
CCC
= 2.4V, V
CCIO
= 3.15V
0.4
V
Input Leakage Current
I
L
V
IN
= V
CCIO
or GND, V
CCC
= 2.6V, V
CCIO
= 3.45V
-10
10
μ
A
Output Leakage Current
I
H
V
IN
= V
CCIO
or GND, V
CCC
= 2.6V, V
CCIO
= 3.45V
-10
10
μ
A
Input Pull-up Leakage Current Low
I
SL
V
IN
= V
CCIO
or GND, V
CCC
= 2.6V, V
CCIO
= 3.45V,
TMS, TRST, TDI
-500
-
μ
A
Input Pull-up Leakage Current High
I
SH
V
IN
= V
CCIO
or GND, V
CCC
= 2.6V, V
CCIO
= 3.45V,
TMS, TRST, TDI
-
10
μ
A
Standby Power Supply Current
I
CCSB
V
CCC
= 2.6V, V
CCIO
= 3.45V, Outputs Not Loaded
-
5
mA
Operating Power Supply Current
I
CCOP
f = 80MHz, V
IN
= V
CCIO
or GND,
V
CCIO
= 3.45V, V
CCC
= 2.6V
-
540
mA (Note
4)
Input Capacitance
C
IN
Freq = 1MHz, V
CCIO
Open, All Measurements Are
Referenced to Device Ground
-
7
pF (Note 5)
Output Capacitance
C
OUT
Freq = 1MHz, V
CCIO
Open, All Measurements are
Referenced to Device Ground
-
7
pF (Note 5)
NOTES:
4. Power Supply current is proportional to operation frequency. Typical rating for I
CCOP
is 7mA/MHz.
5. Capacitance T
A
= 25
o
C, controlled via design or process parameters and not directly tested. Characterized upon initial design and at major
process or design changes.
ISL5217