Pad Coordinates
Pad No.
X
Y
Pad No.
X
Y
1
1070.900
1459.100
13
328.550
2039.750
2
1070.900
1554.100
14
109.963
2052.049
3
1070.900
1657.100
15
19.960
70.043
2052.049
4
1070.900
1752.100
16
2052.049
5
1070.900
1855.100
17
794.300
2045.900
-2045.900
6
1070.900
1950.100
18
889.300
7
1070.900
2053.100
19
1044.974
2089.750
8
869.350
2045.900
20
1062.200
1994.724
9
766.350
2045.900
21
1048.625
1899.700
10
671.350
2045.900
22
1035.400
1792.026
11
568.350
2045.900
23
1035.400
1661.176
12
473.350
2045.900
24
1035.400
1450.676
Pad Description
Pad Name
I/O
Option
Description
PA0~PA7
I/O
Wake-up,
Pull-high
or None
Bidirectional 8-bit I/O port. Each pin can be configured as a wake-up input by
configuration option. Software instructions determine the CMOS output or
Schmitt trigger input with or without pull-high resistor (configuration option).
PB0~PB3
I/O
Pull-high
or None
Bidirectional 4-bit I/O port. Software instructions determine the CMOS output or
Schmitt trigger input (pull-high resistor depending on configuration option).
VSS
Negative power supply, ground
VDD
Positive power supply
VSSP
PWM negative power supply, ground
VDDP
PWM positive power supply
RES
I
Schmitt trigger reset input, active low
OSC1,
OSC2
RC or
Crystal
OSC1 and OSC2 are connected to an RC network or crystal (by configuration
option) for the internal system clock. In the case of RC operation, OSC2 is the
output terminal for 1/4 system clock. The system clock may came form the crys-
tal, the two pins cannot be floating.
PWM1,
PWM2
O
PWM output for driving a external transistor or speaker.
Absolute Maximum Ratings
Supply Voltage ..........................V
SS
+2.4V to V
SS
+5.5V
Storage Temperature ........................... 50 C to 125 C
Input Voltage .............................V
SS
0
.
3V to V
DD
+0.3V
Operating Temperature .......................... 20 C to 70 C
Note: These are stress ratings only. Stresses exceeding the range specified under Absolute Maximum Ratings may
cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed
in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability.
HT83R074
Rev. 1.00
4
May 17, 2007